3D Package Bonding Head and Chuck Table for Flux-Safe Heating
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Solution Overview
Problem
Existing 3D IC bonding processing apparatuses are not entirely satisfactory in terms of stability and efficiency, particularly in protecting flux during the bonding process and achieving high yield, due to inadequate temperature control and component handling.
Innovation Solution
A processing apparatus with a bonding head featuring multiple vacuum tubes for stable component holding, movable pins to protect components from heat, and a temperature-control element in the chuck table, along with a heating module for rapid temperature adjustment, enhances the bonding process by maintaining component stability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chuck table is heated for bonding, then the bonding process can be performed, but the flux on package components may be thermally damaged
Solution Approach 1:
The chuck table is divided into multiple heating zones with independent temperature control, allowing different regions to be heated to different temperatures. This enables the bonding area to be heated while protecting areas with flux from thermal damage.
Solution Approach 2:
Temperature control is applied locally to specific regions of the chuck table rather than uniformly heating the entire surface. The heating elements are positioned and controlled to provide localized heat only where bonding is required, leaving other areas at lower temperatures to protect flux.
2Productivity
If processing time is reduced for efficiency, then productivity increases, but temperature control precision may be compromised
Solution Approach 1:
The chuck table and package components are pre-heated to near-bonding temperatures before the actual bonding process begins. This preliminary heating reduces the temperature differential needed during bonding, allowing faster processing while maintaining precise temperature control throughout the procedure.
Solution Approach 2:
Multiple heating zones operate simultaneously and continuously during the bonding process, maintaining optimal temperatures across all bonding areas without interruption. This continuous heating of multiple zones in parallel reduces total processing time while preserving temperature precision through independent control of each zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures stable and efficient bonding by protecting flux from thermal damage, reducing processing time, and increasing yield through precise temperature control and efficient energy consumption.
Implementation Method 1
a bonding head with a plurality of vacuum tubes communicating to different vacuum
Implementation Method 2
a temperature-control element disposed in the chuck table. The temperature-control element controls the temperature of the chuck table quickly enough to protect the flux on the package components
Implementation Method 3
a heating module for rapid heating of the package component in the processing chamber before the bonding process is performed
Data Source
AI summary
An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.