Electronic Package Box 3D Component Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic device package boxes require multiple mounting boards of varying heights and complex assembly processes to accommodate electronic components, leading to increased complexity and component integration challenges.
Innovation Solution
An electronic device package box design featuring a base unit with first pins and a cover unit with second pins, allowing for three-dimensional mounting of components without additional mounting plates, using first and second connection sections for secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple mounting boards of varying heights are used to accommodate electronic components, then the packaging space can accommodate sufficient number of electronic components, but the device complexity and assembly complexity increase
Solution Approach 1:
The patent merges multiple mounting boards into a single integrated base structure. The base includes an integrated circuit board with multiple mounting surfaces at different levels, eliminating the need for separate mounting boards of varying heights. This integration reduces the number of components and simplifies assembly while maintaining the capability to accommodate sufficient electronic components through the multi-level mounting surfaces.
Solution Approach 2:
The patent utilizes three-dimensional mounting spaces created by the base structure and cover configuration. By establishing mounting surfaces at different vertical levels within the packaging space, the design enables electronic components to be mounted in multiple dimensions rather than requiring multiple separate mounting boards, thus reducing assembly complexity while maintaining component capacity.
2Adaptability or versatility
If mounting boards of varying heights are used, then electronic components can be accommodated, but integration and assembly become complicated
Solution Approach 1:
The patent integrates multiple mounting functions into a single base structure with multi-level surfaces. This consolidation maintains the adaptability to accommodate various electronic components while significantly simplifying integration and assembly processes by eliminating the need to handle and assemble multiple separate mounting boards of varying heights.
Solution Approach 2:
The integrated base structure serves multiple mounting functions simultaneously through its multi-level surfaces. This universal design allows the single base to accommodate different types and sizes of electronic components that would otherwise require multiple specialized mounting boards, thereby simplifying both manufacturing and assembly while maintaining component accommodation versatility.
Data Source
AI summary
An electronic device package box includes a base having a pin-protruding face and a first mounting face for mounting a plurality of electronic components thereto, a plurality of first pins mounted to the base for electrical connection with the electronic components and each including a first connection section protruding from the pin-protruding face, a cover connected to and cooperating with the base to define a packaging space, and a plurality of second pins mounted to the cover for electrical connection with a plurality of electronic components. The cover has a second mounting face for mounting the electronic components thereto. Each second pin includes a second connection section protruding from one of the base and the cover.