Electronic Device Package Brazing Metal Containment
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Solution Overview
Problem
Existing electronic device packages face issues with short-circuits due to excess brazing metal spreading on the side walls, which can interfere with the operation of high-frequency devices and complicate X-ray inspections.
Innovation Solution
A package design featuring a casing and lid with insulating materials and sealing metals, where the lid's sealing metal has a frame shape with a wider area than the casing's, allowing excess brazing metal to solidify on the lid rather than the side walls, preventing short-circuits and maintaining high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If seam-sealing with brazing metal is used to fix the lid on the casing, then the package achieves reliable sealing and structural integrity, but excess brazing metal spreads on the side wall causing short-circuits
Solution Approach 1:
The patent introduces an intermediate metal layer between the brazing metal and the side wall of the casing. This intermediate layer acts as a mediator that receives the excess brazing metal, preventing it from reaching the side wall and causing short-circuits. The intermediate layer is specifically designed to be compatible with the brazing metal while electrically isolating it from sensitive components.
Solution Approach 2:
The patent extracts the harmful function of the excess brazing metal by providing a dedicated metal layer that selectively captures only the excess portion. This allows the useful sealing function to be maintained while removing the harmful short-circuit risk through spatial separation.
2Object-affected harmful factors
If the casing provides a metal layer to capture excess brazing metal, then short-circuit risk is reduced, but the device complexity increases due to additional metal layer deposition processes
Solution Approach 1:
The patent merges the protective metal layer with the existing sealing structure by integrating it into the lid-casing assembly process. The metal layer is deposited on the same surface that undergoes brazing, combining the sealing and protection functions into a single manufacturing step rather than adding separate complex processes.
3Object-affected harmful factors
If the lid's sealing metal has a wider frame shape than the casing's sealing metal, then excess brazing metal is contained on the lid, but the manufacturing precision requirements increase for aligning the sealing metals
Solution Approach 1:
The patent applies preliminary action by pre-forming the wider frame-shaped sealing metal on the lid before the brazing process. This pre-formed structure serves as a predetermined receptacle for the excess brazing metal, eliminating the need for complex real-time alignment adjustments during manufacturing and reducing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents excess brazing metal from causing short-circuits and ensures reliable operation of high-frequency electronic devices while allowing for clear X-ray inspections by directing the excess metal to a wider sealing area on the lid, thus maintaining the integrity of the electronic device's performance.
Implementation Method 1
The lid is fixed on the casing by, for instance, the seam-sealing that melts a brazing metal
Data Source
AI summary
A package for an electronic device is disclosed. The package includes a metal base, an insulating casing mounted on the metal base and having a seating metal on the top thereof, and a lid tightly enclosing a space surrounded by the base and the casing. The lid provides a sealing metal facing the sealing metal on the top of the casing with putting a brazing metal therebetween. The sealing metal of the lid has an area wider than an area of the sealing metal of the casing.