Semiconductor Package Capacitor Layout for EMI Noise Suppression
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Solution Overview
Problem
Existing electronic devices with inverter circuits for motor driving face challenges in effectively suppressing both internal and external electromagnetic noise, which affects the reliability and performance of the devices.
Innovation Solution
The electronic device incorporates a semiconductor package with a capacitor configuration where a conductor member inside the sealing body is bonded to a conductive connection member, connecting a semiconductor chip's pad to a lead, and a conductor pattern on the wiring board, forming a capacitor that overlaps the conductor member, thereby enhancing noise filtration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a floating conductor is coupled through a capacitor to a ground conductor to suppress noise spreading, then noise suppression is improved, but device complexity increases
Solution Approach 1:
The patent combines the capacitor structure with the existing semiconductor device packaging by forming the first conductor member inside the sealing body and bonding it to the conductive connection member, integrating the noise suppression function into the device structure rather than adding separate components
Solution Approach 2:
The patent introduces a conductor pattern on the wiring board as an intermediary element that forms a capacitor with the first conductor member, creating an effective noise suppression mechanism while maintaining structural integration
2Object-affected harmful factors
If the distance between conductor member and conductor pattern is minimized to increase capacitance, then noise attenuation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent nests the first conductor member within the sealing body in close proximity to the conductor pattern on the wiring board, creating a compact capacitor structure where the small distance between conductors is achieved through the nested arrangement of components
Solution Approach 2:
The patent changes the spatial parameter of the conductor member's position by bonding it to the conductive connection member at a specific location, optimizing the distance to the conductor pattern to achieve desired capacitance values for effective noise attenuation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively attenuates noise across a wide frequency range, improving the reliability of the electronic device by reducing electromagnetic interference and susceptibility, and is cost-effective by minimizing the size and manufacturing costs of the semiconductor and wiring board.
Implementation Method 1
a first capacitor is composed of the first conductor member and the conductor pattern
Data Source
AI summary
An electronic device includes a wiring board and a semiconductor device on the wiring board's main surface. The semiconductor device includes a semiconductor chip on a die pad sealed by a sealing body. A back surface of the die pad is directed to a main surface of the sealing body. A back surface of the sealing body faces the main surface of the wiring board. First and second electrodes are formed on the wiring board and in the sealing body, respectively. The second electrode is disposed in the back surface of the sealing body, and is bonded to a metal plate connecting a lead and a pad. A distance between the first and second electrodes is shorter than that between the metal plate and the first electrode. The first and second electrodes overlap each other in a plan view. A capacitor is composed of the first and second electrodes.