Package Structure Capillary TIM Confinement
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Solution Overview
Problem
Conventional package structures face issues with thermal interfacing materials overflowing due to warpage or dam structure failure, leading to inefficient thermal dissipation and electrical connection degradation.
Innovation Solution
A package structure featuring a confining structure with 1-dimensional features, such as nanowires, that utilize capillary forces to confine thermal interfacing materials between the electronic component and the heat dissipating element, preventing overflow and ensuring homogeneous thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal interfacing material is used to transmit heat, then thermal dissipation efficiency is improved, but the material may overflow due to warpage or dam structure failure, deteriorating electrical connection performance
Solution Approach 1:
The thermal interfacing material is segmented into discrete droplets or pools confined within dam structures, preventing continuous overflow while maintaining thermal contact. The segmentation allows each droplet to be independently contained, ensuring that thermal conductivity is maintained without compromising electrical connection integrity.
Solution Approach 2:
A confining structure consisting of dam structures acts as an intermediary between the thermal interfacing material and the electrical connections. This intermediary component prevents the thermal material from directly contacting and deteriorating the electrical connections, while still allowing heat transmission through the confined material.
2Reliability
If the thermal interfacing material is confined to prevent overflow, then electrical connection performance is improved, but the flowable portion may still break through the dam structure due to warpage
Solution Approach 1:
The dam structures are designed with sufficient height and structural strength to counteract the warpage forces acting on the thermal interfacing material. The confining structure provides a counterbalancing mechanical constraint that prevents the material from breaking through, maintaining both electrical connection reliability and structural integrity under thermal and mechanical stress.
3Temperature
If a confining structure is introduced to prevent overflow, then thermal dissipation efficiency is maintained, but device complexity increases
Solution Approach 1:
The confining structure serves multiple functions simultaneously: it confines the thermal interfacing material to prevent overflow, provides mechanical support against warpage, and acts as an electrical isolation barrier. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while maintaining thermal dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents thermal interfacing material overflow, maintains efficient thermal dissipation, and supports the heat dissipating element to maintain stable electrical connections, even with warpage, enhancing overall package performance.
Implementation Method 1
The TIM is attached to the confining structure by capillary force
Data Source
AI summary
A package structure is provided. The package structure includes an electronic component, a heat dissipating element, a thermal interfacing unit, and a confining structure. The electronic component has an upper surface. The heat dissipating element is over the upper surface of the electronic component. The thermal interfacing unit is between the upper surface of the electronic component and the heat dissipating element. The thermal interfacing unit includes a thermal interfacing material (TIM). The TIM is attached to the confining structure by capillary force.