Semiconductor Package Carrier Support During Encapsulation

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Solution Overview

Problem

Existing methods for forming semiconductor packages face challenges in providing stable mechanical support for circuit carriers during encapsulation processes without additional processing steps or tools, which can increase costs and reduce reliability.

Innovation Solution

Utilizing electrical interconnection processing techniques to form mechanical connections between the circuit carrier and the lead frame, which are electrically inactive, ensuring physical support during encapsulation, thus eliminating the need for dedicated support structures or tools.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If dedicated support structures or tools are used to provide mechanical support for circuit carriers during encapsulation, then mechanical stability is improved, but device complexity and production cost increase

Engineering Contradiction:

Improvemechanical stabilityVSAvoiddevice complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent merges the mechanical support function with the electrical interconnection function by using the same processing techniques (soldering, wire bonding, tape automated bonding) to form both electrical connections and mechanical support structures. This integration eliminates dedicated support structures, reducing device complexity while maintaining mechanical stability during encapsulation

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrical interconnection structures serve dual purposes: providing electrical connectivity and providing mechanical support for the circuit carrier during encapsulation. This multi-functionality approach allows existing electrical connection elements to also act as mechanical supports, eliminating the need for separate support tools or structures

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Stability of the object's composition

If dedicated support structures or tools are used to provide mechanical support for circuit carriers during encapsulation, then mechanical stability is improved, but production cost increases

Engineering Contradiction:

Improvemechanical stabilityVSAvoidproduction cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent combines mechanical support formation with electrical interconnection processing into a single integrated process. By using the same soldering, wire bonding, or TAB techniques to create both electrical connections and mechanical support, the patent eliminates additional processing steps, tools, and materials that would increase production cost

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrical interconnection structures automatically provide mechanical support as a byproduct of the electrical connection process. The circuit carrier's own interconnection elements serve as their mechanical support, eliminating the need for external support structures or additional manufacturing steps

Inventive Principle:

Principle #25Self-service

3Device complexity

If electrical interconnection processing techniques are used to form mechanical connections, then device complexity is reduced, but mechanical support stability may be compromised

Engineering Contradiction:

Improvedevice complexityVSAvoidmechanical support stability

Core Design Contradiction:

Device complexityVSStability of the object's composition

Solution Approach 1:

The patent merges electrical interconnection and mechanical support functions into unified structures formed by electrical interconnection processing techniques. The solder joints, wire bonds, or TAB connections that provide electrical connectivity also serve as mechanical support points, ensuring stability without adding complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrical interconnection elements are designed to perform both electrical and mechanical functions simultaneously. The same soldered joints or bonded structures that conduct electricity also provide the mechanical support needed to hold the circuit carrier stable during encapsulation

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250349816A1Semiconductor package with carrier support structure

Publication Date: 2025.11.13 INFINEON TECH AUSTRIA AG

AI summary

A method of forming a semiconductor package includes providing a lead frame that comprises a plurality of leads connected with a peripheral structure; providing a plurality of die pads each having a power switching device mounted thereon; providing a first circuit carrier with a controller device mounted thereon, the controller device being configured to control a switching operation of the power switching devices; forming a mechanical connection between the first circuit carrier and the lead frame; and performing an encapsulation process to form an electrically insulating encapsulant body that encapsulates the power switching devices and the controller device, wherein the first circuit carrier is physically supported by the mechanical connection prior to performing the encapsulation process, and wherein forming the mechanical connection comprises an electrical interconnection processing technique.