Package Carrier Heat-Conducting Structure With Side-Exposed Thermal Path
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Solution Overview
Problem
Existing semiconductor structures face challenges in achieving effective heat dissipation due to limitations in heat-conducting path size, suitability for thin interlayer structures, and indirect contact heat conduction methods, which restrict heat dissipation to the center of the board.
Innovation Solution
A package carrier design that includes a circuit structure layer with a notch portion and a heat-conducting element with a first heat-conducting portion embedded in the circuit layer and a second heat-conducting portion exposed on the side, enhancing contact area for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal pads/bars/x-vias are formed by copper electroplating, then heat conduction in vertical direction is achieved, but the size of heat-conducting path is limited by electroplating ability
Solution Approach 1:
The patent transitions from purely vertical heat conduction (single dimension) to a combination of vertical and horizontal heat conduction paths (multiple dimensions). The heat-conducting element extends vertically from the first circuit layer to the second circuit layer, and also extends horizontally within the second circuit layer, creating a two-dimensional heat dissipation structure that overcomes the size limitations of electroplating-based vertical paths.
2Temperature
If copper blocks are embedded, then vertical heat conduction is achieved, but it is not suitable for structures with thin interlayer thickness
Solution Approach 1:
The heat-conducting element is segmented into multiple portions: a first heat-conducting portion in the first circuit layer, a second heat-conducting portion extending vertically to the second circuit layer, and a third heat-conducting portion extending horizontally in the second circuit layer. This segmentation allows the heat conduction path to adapt to thin interlayer structures by distributing the heat conduction function across multiple smaller segments rather than requiring a single large copper block.
3Temperature
If metal core is used, then horizontal heat conduction is achieved, but blind vias are required for indirect contact heat conduction to the metal core
Solution Approach 1:
The patent merges the vertical heat conduction function (previously requiring blind vias) and horizontal heat conduction function (provided by metal core) into a single integrated heat-conducting element. This element simultaneously provides vertical heat transfer from the first circuit layer to the second circuit layer and horizontal heat dissipation within the second circuit layer, eliminating the need for separate blind vias and simplifying the overall heat conduction path.
4Productivity
If multilayer board structure is used, then circuit functionality is achieved, but vertical heat-conducting path is blocked by other layers
Solution Approach 1:
The heat-conducting element serves multiple functions: it acts as a heat conduction path from the first circuit layer to the second circuit layer, provides horizontal heat dissipation within the second circuit layer, and simultaneously serves as an electrical connection element (conductive via) between circuit layers. This multi-functionality allows the multilayer board structure to maintain its circuit functionality while the heat-conducting element creates an effective heat dissipation path through and within the layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves an improved heat-conducting effect by increasing the contact area with the outside environment, leading to enhanced heat dissipation efficiency and effective thermal management in semiconductor structures.
Implementation Method 1
a heat-conducting element, wherein the first heat-conducting portion directly contacts the first circuit layer
Data Source
AI summary
A manufacturing method of the package carrier includes the following steps. A circuit substrate having a through via is provided. A heat-conducting material layer coving the inner wall of the through via is electroplated on the circuit substrate. A first build-up structure and a second build-up structure are respectively formed on two opposite sides of the circuit substrate. Parts of the first build-up structure, the circuit substrate, the heat-conducting material layer and the second build-up structure are removed to expose the remaining heat-conducting material layer, so as to define a heat-conducting element and form a circuit structure layer including a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conducting portion is aligned with a side surface of the circuit structure layer.