Semiconductor Package Cavity Layout With Partial Lid Encapsulation
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The proposed solution involves a semiconductor device design with a substrate, conductive structure, and encapsulant configuration, where the electronic component is disposed within a substrate cavity and coupled to a conductive structure, with a lid covering part of the component while leaving another portion exposed, and an encapsulant covering the component's lateral side but not its first side, to enhance protection and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost increases and reliability decreases
Solution Approach 1:
The package structure is segmented into distinct functional regions: a substrate cavity for housing components, an encapsulant covering lateral sides for protection, and a lid covering the first side for sealing. This segmentation allows each part to be optimized independently, improving reliability while maintaining manufacturing feasibility through modular assembly.
Solution Approach 2:
The electronic component is nested within the substrate cavity, which is itself nested within the larger package structure. The encapsulant and lid further nest to create a hierarchical protective structure. This nesting approach maximizes space utilization, reducing package size while improving protection and reliability.
2Volume of moving object
If conventional semiconductor packages are used, then manufacturing processes are traditional, but package size becomes too large
Solution Approach 1:
The package design transitions from a traditional planar layout to a three-dimensional structure with a substrate cavity. Components are positioned vertically within the cavity, utilizing the Z-dimension for space optimization. This dimensional change significantly reduces the footprint and overall package size while maintaining ease of manufacture through standardized cavity formation techniques.
Solution Approach 2:
The encapsulant is implemented as a thin film material that conformally covers the lateral sides of the electronic component. This thin-film approach provides adequate protection while minimizing the volume occupied by the encapsulation material, thereby reducing overall package size without compromising manufacturing ease.
3Reliability
If conventional semiconductor packages are used, then protection is standard, but performance decreases
Solution Approach 1:
The package structure applies different levels of protection to different regions: the encapsulant covers lateral sides requiring environmental protection, while the lid covers the first side for sealing. This local quality approach ensures each area receives appropriate protection based on its specific requirements, optimizing performance while minimizing material usage by avoiding over-protection in all areas.
Data Source
AI summary
In one example, an electronic device includes a substrate including a substrate first side, a conductive structure, and a substrate sidewall on the substrate first side. The substrate sidewall forms a perimeter, the substrate first side within the perimeter defines a substrate base, and the substrate sidewall and the substrate base form a substrate cavity. An electronic component includes a component first side, a component second side, and a component lateral side. The electronic component is disposed over a first portion of the substrate base within the substrate cavity and is coupled to the conductive structure. An encapsulant encapsulates at least a portion of the component lateral side, and a lid is over at least a portion of the component first side. At least a portion of the component first side is devoid of the encapsulant. Other examples and related methods are also disclosed herein.