Electronic Package Structure With Cavity Nesting

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Solution Overview

Problem

Conventional electronic package structures have low spatial utilization and large sizes due to the surface disposition of electronic elements, leading to inefficient use of internal space.

Innovation Solution

The proposed electronic package structure incorporates a second electronic element with a cavity to house the first electronic element and a lead frame, allowing for higher internal space utilization by either disposing the first element within the cavity or stacking the second element on the first, thereby reducing the overall size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If electronic elements are disposed on the surface of the PCB or circuit substrate, then the electrical connection is simple, but the spatial utilization is low and the size is large

Engineering Contradiction:

Improveelectrical connection simplicityVSAvoidpackage size

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent places the first electronic element inside the cavity of the second electronic element, creating a nested configuration where one component houses another. This nesting approach maximizes space utilization within the package structure, allowing multiple elements to coexist in a compact arrangement rather than requiring separate surface mounting areas.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from traditional two-dimensional surface mounting to three-dimensional spatial arrangement by utilizing the cavity space within the second electronic element. This vertical integration approach uses the Z-dimension (height/depth) to accommodate additional components, thereby reducing the footprint on the PCB surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If electronic elements are disposed on the surface of the PCB or circuit substrate, then the manufacturing process is simple, but the internal space utilization is low

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidinternal space utilization

Core Design Contradiction:

Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent implements nesting by positioning the first electronic element within the internal cavity of the second electronic element. This configuration efficiently utilizes the otherwise wasted internal space of the second element, transforming it into functional packaging space for additional components without complicating the overall manufacturing process.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent design incorporates the cavity structure of the second electronic element as a pre-prepared space that is specifically intended to house the first electronic element. This preliminary design of the cavity allows for straightforward assembly where the first element is simply placed into the pre-formed space, maintaining manufacturing simplicity while improving space utilization.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8824165B2Electronic package structure

Publication Date: 2014.09.02 CYNTEC

AI summary

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.