Package Cleaning Pad for In-Situ Bonding Tool Cleaning
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Solution Overview
Problem
Bonding tools used in electronic component manufacturing experience downtime and quality issues due to cooling and contamination, leading to suboptimal wire bonding performance.
Innovation Solution
Incorporating a cleaning pad within the electronic component package structure to enable in-situ cleaning of the bonding tool, reducing downtime and improving wire bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the bonding tool is used continuously for wire bonding, then productivity is improved, but the bonding tool cools down during breaks causing wire bonding quality to deteriorate
Solution Approach 1:
The bonding tool is heated to a predetermined temperature before wire bonding operations begin, ensuring the tool reaches optimal operating temperature in advance. This preliminary heating action prevents cooling during breaks and maintains consistent bonding quality throughout the manufacturing process.
Solution Approach 2:
The system actively controls and adjusts the temperature parameter of the bonding tool during manufacturing breaks by applying heat to maintain the tool above the dew point temperature. This parameter change prevents condensation and maintains wire bonding quality even when productivity interruptions occur.
2Reliability
If the bonding tool operates in a clean environment, then wire bonding quality is improved, but cleaning the bonding tool requires downtime reducing productivity
Solution Approach 1:
The bonding tool is equipped with self-cleaning capabilities where cleaning pads are integrated into the tool structure. The tool can clean itself or be quickly cleaned by subsequent components during normal operation, eliminating the need for dedicated cleaning downtime and maintaining continuous productivity while ensuring bonding quality.
Solution Approach 2:
Cleaning pads are nested within or integrated into the bonding tool structure itself. This nesting allows the cleaning function to be embedded within the tool, enabling cleaning to occur in-situ during manufacturing breaks without requiring external cleaning equipment or stopping the manufacturing process.
3Reliability
If the bonding tool is heated to maintain temperature, then wire bonding quality is improved, but energy consumption increases
Solution Approach 1:
Heating is applied periodically only during manufacturing breaks when the bonding tool temperature drops below the predetermined threshold. Instead of continuous heating, the system monitors temperature and applies heat intermittently to maintain quality, significantly reducing energy consumption while preserving wire bonding consistency.
Solution Approach 2:
The system takes preliminary action by heating the bonding tool before breaks occur or when temperature drops, preventing the harmful effect of cooling and condensation. This targeted anti-action against temperature drop reduces overall energy consumption compared to maintaining constant high temperature throughout the entire manufacturing cycle.
Data Source
Figure 1~3
Figure 4~5
Figure 6
AI summary
An electronic component (1) comprises a package (7), at least one electronic chip (2) housed within an enclosure inside the package, and at least one first bonding pad (3), at least one second bonding pad (4), and at least one bond (5) connected to at least one bonding pad (3) and at least one second bonding pad (4) for establishing an electric connection between the electronic chip (2) and surrounding circuitry. A cleaning pad (6) is provided in the package (7). The cleaning pad (6) is spaced from first bonding pad(s) (3) and second bonding pad(s) (4), designed to be electrically disconnected from other structures or components, and designed to enable cleaning of a bonding tool (8).