Semiconductor Package Clip Mounting for Uniform Heatsink Pressure
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Solution Overview
Problem
Existing electronic modules with semiconductor packages face challenges in achieving optimal heat dissipation due to inhomogeneous mounting pressure distribution, which affects thermal resistance between the semiconductor die and the heatsink.
Innovation Solution
The electronic module incorporates a semiconductor package with an integrated clip and fastening element, such as a screw, that connects the package to an external heatsink, ensuring a consistent and enhanced mounting pressure for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws or clips are used to mount the semiconductor package to the heatsink, then the package can be securely fastened, but the mounting pressure distribution becomes inhomogeneous
Solution Approach 1:
The mounting function is segmented into two independent components: a clip that provides uniform pressure distribution and a separate fastening element that provides secure attachment. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The clip acts as an intermediary element between the semiconductor package and the heatsink, distributing the mounting pressure uniformly across the insulation layer while the fastening element secures the assembly. This mediator approach resolves the conflict between secure fastening and uniform pressure distribution.
2Temperature
If mounting pressure is increased to improve heat dissipation, then thermal resistance decreases, but the insulation layer may deform or fail over time
Solution Approach 1:
The clip is designed with specific material properties and geometric parameters (elastic modulus, thickness, width) that allow it to provide optimal mounting pressure within a safe range. These parameters are optimized to achieve sufficient thermal contact pressure while remaining below the deformation threshold of the insulation layer.
Solution Approach 2:
The clip utilizes elastic deformation to dynamically adjust and maintain constant mounting pressure on the insulation layer throughout the product lifetime, compensating for thermal expansion and mechanical settling while preventing permanent deformation.
3Stress or pressure
If a clip is used instead of screws, then mounting pressure distribution improves, but the fastening strength may be insufficient
Solution Approach 1:
The invention merges two previously separate functions into a single integrated mounting system: the clip provides pressure distribution while the integrated fastening element (screw hole or thread) provides secure attachment. This combination achieves both uniform pressure distribution and sufficient fastening strength simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal resistance and enhances heat dissipation capabilities by maintaining consistent pressure across the insulation layer throughout the product's lifetime.
Implementation Method 1
The thermal throughput of such insulation layers highly depends on the mounting pressure coming from the screw or clip. Heat dissipation is strongly related to the mounting pressure all over the insulation layer
Data Source
AI summary
An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heatsink.