Semiconductor Package Clip Layout for Higher Substrate Utilization
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Solution Overview
Problem
The arrangement of conductive pins or posts in semiconductor device packages occupies large areas, limiting design flexibility and substrate layout, and increasing the size of passive components.
Innovation Solution
A semiconductor device package design featuring a clip with separated portions connected by a slit, where the clip is bonded to the substrate using adhesive layers or solder pads, allowing conductive pads to be arranged on the periphery without obstructing electronic components, and an encapsulant supports the clip for structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive pins or posts are disposed directly under passive components, then electrical connection is achieved, but device area is occupied and design flexibility is reduced
Solution Approach 1:
The conductive element is segmented into a first conductive portion extending from the substrate to a first height, and a second conductive portion extending from the substrate to a second height greater than the first height. This segmentation allows different portions to serve different functions at different elevations, enabling electrical connection while reducing the horizontal footprint and freeing up device area for component placement.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of conductive elements to a three-dimensional structure with multiple heights. By extending conductive portions to different heights vertically, the design utilizes the Z-dimension to achieve electrical connections without occupying excessive horizontal space on the substrate, thereby resolving the area occupation issue.
2Reliability
If conductive pins or posts are used for electrical connection, then connectivity is established, but substrate layout flexibility is adversely affected
Solution Approach 1:
The segmented conductive structure with portions at different heights provides multiple connection points and pathways for electrical signals. This segmentation enables more flexible routing options and component arrangements on the substrate, as connections can be made at different elevation levels rather than requiring direct planar alignment, thereby improving substrate layout flexibility.
Solution Approach 2:
The multi-height conductive structure introduces dynamic spatial arrangement capabilities, where conductive elements at different levels can accommodate varying component positions and orientations. This dynamic three-dimensional configuration allows the substrate layout to adapt more freely to different design requirements while maintaining reliable electrical connections.
3Area of stationary object
If passive components are stacked vertically to reduce package area, then package footprint is reduced, but conductive element arrangement becomes more complex
Solution Approach 1:
By utilizing vertical stacking with conductive portions at different heights, the patent naturally accommodates the vertically stacked passive components. The multi-height conductive structure provides connection points at each elevation level, enabling electrical connections to stacked components without requiring complex lateral routing or additional conductive elements, thus simplifying the overall arrangement while maintaining reduced package footprint.
Solution Approach 2:
The nested arrangement of conductive portions at different heights within the vertical stack allows for efficient space utilization. Each conductive portion is positioned at a specific height to connect with corresponding components, creating a nested hierarchical structure that simplifies the connection architecture compared to alternative complex routing schemes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the area occupied by conductive elements, enhances substrate utilization, and improves the reliability and flexibility of the semiconductor device package by allowing for more efficient arrangement of electronic components.
Implementation Method 1
The clip is bonded to the substrate using adhesive layers or solder pads
Implementation Method 2
The clip is bonded to the substrate using adhesive layers or solder pads
Data Source
AI summary
A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.