Electronic Package Conductive Structure Thickness Reduction

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Solution Overview

Problem

Conventional electronic package structures, such as wire-bonding and COB types, face challenges in achieving thinness due to the thickness of encapsulants and the difficulty in fabricating and integrating conductive through silicon vias, which are costly and hard to control.

Innovation Solution

The electronic package design embeds an electronic element with a sensing area exposed on an insulator surface, connected by a conductive structure with multiple height levels, including lead frames and conductive bumps, allowing for reduced thickness and simplified fabrication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If wire-bonding type package structure is used, then electrical connection is achieved, but the encapsulant thickness cannot be controlled and thinning is difficult

Engineering Contradiction:

Improveencapsulant thickness controlVSAvoidpackage structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent removes the wire bonding structure and gold wires from the package, extracting the problematic element that caused encapsulant thickness control issues. The electronic element is directly mounted on the substrate with exposed sensing area, eliminating the need for thick encapsulant to accommodate wire loops.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of encapsulating the entire electronic element including its connection structure, the patent inverts the approach by exposing the sensing area directly without encapsulation, while only protecting non-sensitive portions. This allows precise thickness control of the protective layer.

Inventive Principle:

Principle #13The other way round (Inversion)

2Manufacturing precision

If COB type package structure is used, then camera lens integration is achieved, but the package cannot be easily thinned

Engineering Contradiction:

Improvepackage thicknessVSAvoidfabrication difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent segments the protective structure into functional zones: a first protective layer covering non-sensing areas and a second protective layer (or exposed area) for the sensing region. This segmentation allows differential thickness control and eliminates the need for uniform thick encapsulation required in COB structures.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If through silicon via technology is used, then electrical connection is achieved, but fabrication cost increases

Engineering Contradiction:

Improvefabrication costVSAvoidelectrical connection reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces expensive through silicon via structures with simpler, cheaper conductive elements such as conductive adhesive layers or printed circuit board traces. These lower-cost conductive structures achieve the same electrical connection function without the high fabrication costs of TSV technology.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS10204865B2Electronic package and conductive structure thereof

Publication Date: 2019.02.12 PHOENIX PIONEER TECH

AI summary

An electronic package is provided, which includes: an insulator; an electronic element embedded in the insulator and having a sensing area exposed from the insulator; and a conductive structure disposed on the insulator and electrically connected to the electronic element, thereby reducing the thickness of the overall structure.