Package Connector Mounted on Integrated Heat Spreader
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Solution Overview
Problem
Conventional interconnect designs face signal integrity limitations beyond 40 GHz due to resistance and capacitance parasitic effects, hindering the scaling of high-speed IO interfaces, and existing solutions for package miniaturization and connector density scaling are inadequate.
Innovation Solution
A semiconductor package with a package connector mounted on an integrated heat spreader, which reduces electrical losses and eliminates the need for additional components like retention mounting clips and alignment holes, allowing for improved signal integrity and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnect designs (through package and PCB interconnects) are used, then package functionality is achieved, but signal integrity deteriorates beyond 40 GHz due to RC parasitic effects
Solution Approach 1:
The patent extracts the connector from the conventional package substrate location and relocates it to the motherboard, removing the source of RC parasitic effects from the high-speed signal path. This extraction eliminates the deteriorating influence on signal integrity while maintaining electrical connection functionality.
Solution Approach 2:
The invention changes the spatial dimension of the connector location from within the package (2D plane on package substrate) to outside the package (mounted on motherboard). This dimensional shift repositions the connector in a new spatial context that eliminates parasitic degradation of high-speed signals.
2Ease of operation
If existing on-package connector solutions are implemented, then connector interconnection is achieved, but package substrate real estate is consumed, inhibiting package miniaturization
Solution Approach 1:
The connector is extracted from the package substrate and relocated to the motherboard. This removal eliminates the area occupation on the package substrate, enabling package miniaturization while preserving connector interconnection capabilities through the relocated mounting position.
Solution Approach 2:
By relocating the connector from the package substrate plane to the motherboard plane, the invention utilizes a different spatial dimension for connector mounting. This dimensional transition frees up package substrate area while maintaining connector functionality through the new mounting location.
3Stability of the object's composition
If additional connector components (mounting pads, retention mounting clips, alignment holes) are added, then connector stability is improved, but device complexity increases
Solution Approach 1:
The motherboard serves multiple functions: it provides both the mounting surface for the connector and the electrical connection path. This multi-functionality eliminates the need for separate dedicated mounting structures, reducing component count while maintaining connector stability through the motherboard's inherent structural and electrical properties.
Data Source
AI summary
A semiconductor package may include a semiconductor device coupled to a package substrate. The semiconductor package may also include an integrated heat spreader coupled to the package substrate. The semiconductor package may further include a package connector mounted on the integrated heat spreader. According to various examples, a semiconductor system is also described. The semiconductor system may include a first semiconductor package. The first semiconductor package may include a first package connector, and a first integrated heat spreader. The first package connector may be mounted on the first integrated heat spreader. The semiconductor system may also include a second semiconductor package. The second semiconductor package may include a second package connector, and a second integrated heat spreader. The second package connector may be mounted on the second integrated heat spreader. The first package connector may be electrically connected to the second package connector.