Semiconductor Package Connectors With Alignment Features for Dense Assembly
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Solution Overview
Problem
The semiconductor industry faces challenges in packaging smaller semiconductor devices with high integration density and requiring smaller packages that utilize less area, while maintaining efficient electrical connections and alignment accuracy.
Innovation Solution
The use of connectors with alignment features formed on a borofloat glass plate, patterned using a half-tone lithography mask, to create solder ball structures for attaching substrates, allowing for precise alignment and electrical connections in die-to-die, wafer-to-die, and wafer-to-wafer packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If smaller packages are used to reduce area utilization, then area usage is reduced, but alignment accuracy deteriorates
Solution Approach 1:
The package is segmented into functional regions including a first region for the semiconductor die, a second region for connectors, and a third region for alignment features. This segmentation allows the alignment features to be spatially separated from the die area, enabling larger alignment structures without increasing the overall die area, thus resolving the contradiction between small package size and alignment accuracy.
Solution Approach 2:
Alignment features are extended in the vertical dimension by forming protrusions that extend from the substrate surface. This dimensional transition from 2D planar alignment marks to 3D protruding structures enhances alignment accuracy without increasing the horizontal footprint, thereby maintaining small package area while improving manufacturing precision.
2Manufacturing precision
If connectors with alignment features are formed on borofloat glass plates, then alignment accuracy is improved, but device complexity increases
Solution Approach 1:
The alignment features are merged with the connector structures, forming integrated components that serve both electrical connection and alignment functions. This consolidation eliminates the need for separate alignment marks and connectors, reducing overall packaging structure complexity while maintaining high alignment accuracy.
Solution Approach 2:
The connectors are designed with dual functionality: providing electrical connections and serving as alignment references. This multi-functionality reduces the number of discrete components needed in the packaging structure, simplifying the overall device complexity while achieving precise alignment through the connector features themselves.
3Manufacturing precision
If half-tone lithography masks are used for patterning, then manufacturing precision is improved, but ease of manufacture decreases
Solution Approach 1:
The lithography process parameters are optimized by using half-tone masks that create specific optical density variations. This parameter change in the lithography approach enables precise patterning of the alignment features and connector structures, achieving high manufacturing precision through controlled light transmission variations during exposure.
Data Source
AI summary
Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes an integrated circuit die mounting region, a molding material around the integrated circuit die mounting region, and an interconnect structure over the molding material and the integrated circuit die mounting region. The interconnect structure has contact pads, and connectors are coupled to the contact pads. Two or more of the connectors have an alignment feature formed thereon.