Semiconductor Package Connectors With Linking Portions for Plating Alignment
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, poor thermal performance, decreased reliability, and large package sizes, which hinder their effectiveness and efficiency in manufacturing.
Innovation Solution
A method and structure for forming packaged electronic devices that utilize conductive connectors with plate and connective portions, which are aligned and connected through conductive linking portions to facilitate direct attachment to subsequent assembly levels without intervening leads, enabling cost-effective and reliable packaging with improved yields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but cost is excessive and reliability is poor
Solution Approach 1:
The package structure is divided into distinct functional segments: a first substrate for die attachment, a second substrate for conductive connectors, and intermediate connective portions. This segmentation allows each component to be optimized independently for reliability while managing overall complexity through modular assembly.
Solution Approach 2:
Intermediate substrates and connective portions are introduced as intermediary elements between the die and final package connections. These intermediaries provide mechanical support, electrical connectivity, and alignment functions, improving reliability without requiring direct complex connections between all components.
2Temperature
If conventional package structures are used, then manufacturing process is simpler, but thermal performance is poor
Solution Approach 1:
Traditional mechanical thermal management approaches are replaced with direct thermal conduction paths through conductive substrates and connectors. The substrates are designed with thermal conductivity as a primary function, creating efficient heat sinks and heat spreaders that improve thermal performance.
Solution Approach 2:
The package structure employs composite material systems combining conductive metals for thermal and electrical pathways with insulating materials for structural support. This composite approach enables simultaneous optimization of thermal performance and structural integrity without excessive complexity.
3Volume of moving object
If conventional packages are used, then manufacturing is simpler, but package size is too large
Solution Approach 1:
The package structure transitions from planar two-dimensional layouts to three-dimensional stacked configurations. Multiple functional layers are vertically integrated, allowing compact packaging while maintaining necessary electrical and thermal pathways. This dimensional change reduces overall package footprint and volume.
Solution Approach 2:
Components are nested within each other in a hierarchical structure where substrates, connectors, and die are integrated in concentric or layered arrangements. This nesting minimizes wasted space and reduces overall package volume while maintaining structural complexity management through systematic integration.
4Ease of manufacture
If conventional packages are used, then manufacturing is simpler, but cost is excessive
Solution Approach 1:
Alignment features and positioning structures are pre-formed on substrates before final assembly. Conductive connectors are pre-attached to substrates with built-in alignment mechanisms, enabling rapid and reliable assembly without complex real-time alignment procedures. This preliminary preparation maintains manufacturing simplicity while ensuring high reliability.
Solution Approach 2:
Manufacturing parameters such as attachment forces, temperatures, and alignment tolerances are optimized for each assembly stage. By controlling key parameters during substrate bonding and connector attachment, the process achieves high reliability through consistent quality while maintaining manufacturing efficiency and cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces costs, enhances reliability, and improves the performance of packaged electronic devices by maintaining alignment and providing a conductive path for plating processes, resulting in more efficient and cost-effective semiconductor packages.
Implementation Method 1
The conductive linking portions are configured to provide a connected and conductive current path for a plating process used to provide a conductive solder layer on exposed portions of the package electronic device during the assembly process
Data Source
AI summary
A method for forming packaged electronic devices includes providing a substrate having pads connected by conductive pad linking portions and semiconductor devices attached to the pads in different orientations. A second substrate is provided having conductive connectors each with a plate portion, a conductive member extending from a side segment of the plate portion, a connective portion extending from the conductive member distal to the plate portion, and conductive linking portions physically connecting adjoining plate portions together. Each plate portion is attached to one of the semiconductor devices to provide a subassembly. A package body is provided to encapsulate at least portions of the subassembly. The method includes separating the encapsulated subassembly to provide the packaged electronic devices such that the separating step severs the conductive linking portions.