Semiconductor Package Contact Structure for Uniform PCB Soldering
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Solution Overview
Problem
Current semiconductor device packages face challenges in achieving optimal package density and reliable electrical contact connections due to limitations in the exposure and formation of solder balls, which affect the connection with external PCBs.
Innovation Solution
The semiconductor device package design includes a substrate with insulation layers and electrical contacts where a portion is exposed and surrounded by the insulation, with a neck portion between, allowing for controlled solder paste printing to form reliable and uniformly thick external terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are exposed from molding compound to enable external board connection, then electrical connection capability is improved, but package density and manufacturing reliability deteriorate due to exposure control difficulties
Solution Approach 1:
The electrical contact is divided into multiple segments: a first portion surrounded by insulation layer, a second portion exposed from insulation layer, and a neck portion connecting them. This segmentation allows each portion to serve different functions - the first portion for electrical connection, the second for soldering, and the neck for structural support, thereby improving both connection reliability and exposure precision.
Solution Approach 2:
Different portions of the electrical contact are designed with different local qualities - the first portion has larger cross-sectional width for electrical conductivity, the neck portion has reduced width for mechanical support, and the second portion tapers for solder joint formation. This local differentiation optimizes both connection reliability and manufacturing precision.
2Productivity
If dual-side assembly is employed to increase package density, then productivity is improved, but device complexity increases due to additional assembly requirements
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support, electrical connection pathways, and mounting surfaces for both first and second electrical contacts on opposite sides. The insulation layer similarly provides both electrical isolation and structural support. This multi-functionality enables dual-side assembly for increased package density while avoiding additional complex components.
Data Source
AI summary
A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.