Package Cooling by Coil Cavity in Semiconductor Assemblies
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Solution Overview
Problem
In vertically stacked semiconductor die packages, heat dissipation is challenging due to increased operating temperatures caused by compact size and proximity of die packages, leading to thermal management issues.
Innovation Solution
A cooling channel is formed within the encapsulant of the package casing by removing a sacrificial member, allowing for efficient fluid flow to facilitate heat transfer from the die packages, which includes connecting a fluid management system to the formed cavity to direct fluid through the channel and a heat exchanger for effective heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor dies are vertically stacked to increase processing power without increasing footprint, then the functional capacity and processing power are improved, but heat dissipation becomes difficult and operating temperatures increase
Solution Approach 1:
The patent introduces a thermal management system that extends heat dissipation into the vertical dimension by implementing cooling channels within the substrate and using heat sinks positioned above and below the stacked dies. This multi-dimensional thermal management approach allows heat to be conducted away from the die stack in multiple directions (up, down, and laterally through the substrate), effectively managing the thermal load of high-power vertically-stacked configurations without increasing the horizontal footprint.
2Volume of moving object
If die packages are moved closer together to decrease assembly size, then the overall device size is reduced, but heat from adjacent packages increases the operating temperature of each die package
Solution Approach 1:
The patent employs the substrate as an intermediary thermal management component that actively conducts heat away from closely-spaced die packages. The substrate incorporates integrated cooling channels that act as thermal pathways, intercepting and transporting heat from multiple adjacent die stacks before it can accumulate and raise the operating temperature of individual packages. This intermediary thermal conduction system enables compact packaging while maintaining acceptable operating temperatures.
3Area of stationary object
If the package footprint is reduced to fit space constraints, then the device compactness is improved, but the ability to dissipate heat from vertically-stacked dies deteriorates
Solution Approach 1:
The patent utilizes fluid-based thermal management by implementing cooling channels within the substrate that circulate coolant to actively remove heat from vertically-stacked dies. The hydraulic cooling system flows thermal management fluid through channels positioned beneath and around the die stack, efficiently conducting heat away from the compact package. This fluid-based approach enables effective heat dissipation from high-density vertical stacks without increasing the horizontal package footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances temperature management in compact die package systems by efficiently dissipating heat, reducing operating temperatures and improving the reliability of the semiconductor devices.
Implementation Method 1
allowing for efficient fluid flow to facilitate heat transfer from the die packages
Implementation Method 2
connecting a fluid management system to the formed cavity to direct fluid through the channel and a heat exchanger for effective heat removal
Data Source
AI summary
A semiconductor device assembly can include a first die package comprising a bottom side; a top side; and lateral sides extending between the top and bottom sides. The assembly can include an encapsulant material encapsulating the first die package. In some embodiments, the assembly includes a cooling cavity in the encapsulant material. The cooling cavity can have a first opening; a second opening; and an elongate channel extending from the first opening to the second opening. In some embodiments, the elongate channel surrounds at least two of the lateral sides of the first die package. In some embodiments, the elongate channel is configured to accommodate a cooling fluid.