Heat Dissipation Cover Structure for Semiconductor Package Cooling
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Solution Overview
Problem
Conventional heat dissipation architectures for semiconductor packaging modules are inadequate, leading to reduced stability and product life due to insufficient heat dissipation capabilities.
Innovation Solution
A semiconductor packaging device with a heat dissipation cover featuring a metal cover, accommodating recess, and protrusive columns, combined with a non-solid thermal interface material layer, which enhances heat dissipation by direct contact and efficient thermal energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation architecture is used, then device simplicity is maintained, but heat dissipation performance is insufficient
Solution Approach 1:
The heat dissipation cover is segmented into multiple functional components: a metal cover for heat conduction, an accommodating recess for structural integration, and multiple protrusive columns for enhanced thermal contact. This segmentation allows each component to perform its specific function optimally, resolving the contradiction between heat dissipation performance and structural simplicity.
Solution Approach 2:
The protrusive columns act as thermal intermediaries between the working chip and the metal cover. These columns increase the contact area and improve thermal coupling, serving as a mediator that enhances heat transfer from the chip to the heat dissipation cover without requiring complex additional structures.
2Temperature
If heat dissipation performance is improved through better thermal contact, then heat dissipation efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The thermal interface material is applied locally within the accommodating recess, specifically at the interfaces where protrusive columns contact the working chip and metal cover. This localized application ensures optimal thermal contact where needed most, while reducing the overall complexity and precision requirements compared to uniform thermal interface application across the entire surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation performance, thereby increasing the stability and product life of semiconductor packaging modules.
Implementation Method 1
The thermal interface material layer, which is non-solid, is located within the accommodating recess between the protrusive columns, wraps the protrusive columns to be in direct contact with the working chip, the metal cover and the protrusive columns
Data Source
AI summary
A semiconductor packaging device includes a packaging module, a heat dissipation cover and a thermal interface material layer. The package module includes a substrate, and a working chip mounted on the substrate. The heat dissipation cover includes a metal cover fixed on the substrate and covering the working chip, an accommodating recess located on the metal cover to accommodate the working chip, and a plurality of protrusive columns respectively formed on the metal cover and distributed within the accommodating recess at intervals. The depth of the accommodating recess is greater than the height of each protrusive column, and the accommodating recess is greater than the working chip. The thermal interface material layer is non-solid, and located within the accommodating recess between the protrusive columns to wrap the protrusive columns and contact with the working chip, the metal cover and the protrusive columns.