Integrated Package Cooling for AI Processor and HBM Heat Control
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Solution Overview
Problem
High computational loads in semiconductor devices, particularly those executing AI and ML algorithms, result in significant heat generation, leading to increased refresh rates, power consumption, and potential damage, which undermines efficiency and computational power.
Innovation Solution
Integration of a package cooling device with thermoelectric cooling (TEC) devices to actively remove heat from processing and high-bandwidth memory devices, coupled with peripheral cooling systems to manage thermal loads and control fluid properties for optimal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If computational power and circuit density are increased to meet market demands, then processing capability is improved, but heat generation increases leading to thermal management challenges
Solution Approach 1:
The patent segments the thermal management function by integrating dedicated thermoelectric cooling devices (TECs) with each high-bandwidth memory stack, rather than using a single centralized cooling system. This allows localized heat removal at the source, effectively managing thermal loads in high-density configurations without compromising computational power
Solution Approach 2:
The patent introduces thermoelectric cooling devices as intermediary components between the heat-generating memory stacks and the heat dissipation path. These TECs act as active thermal mediators that convert electrical energy into directed heat pumping, transferring heat from the memory dies through thermal interface materials to heat sinks, thereby maintaining operational temperatures during high-computational workloads
2Volume of moving object
If device footprint is reduced to meet market demands, then integration density is improved, but thermal management becomes more challenging
Solution Approach 1:
The patent transitions from planar (2D) heat dissipation to three-dimensional (3D) thermal management by stacking memory dies vertically and integrating TECs within the stack architecture. This vertical integration allows heat to be managed in the z-dimension through dedicated thermal paths, enabling high-density footprints while maintaining effective heat removal through multiple thermal interfaces and heat sinks positioned at different elevations
Solution Approach 2:
The patent implements nested thermal management by placing thermoelectric cooling devices and thermal interface materials within the existing memory stack architecture. The TECs are nested between memory dies and heat sinks, utilizing the vertical space already allocated in the high-bandwidth memory structure. This nested arrangement enables active cooling without increasing the lateral footprint, as cooling components are integrated into the vertical stack rather than adding lateral expansion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated cooling system maintains device temperature below critical thresholds, preventing throttling and extending device lifetime while enhancing computational power and efficiency.
Implementation Method 1
a package cooling device including a first thermoelectric cooling device thermally coupled to the first heat spreader
Implementation Method 2
a fluid cooling system configured to cool the fluid... including a heat exchanger
Implementation Method 3
a thermal interface material between the memory device and the first heat spreader
Data Source
AI summary
Semiconductor devices having integrated cooling systems, and associated systems and methods, are disclosed herein. An example of a semiconductor device according to the present technology is a system-in-package device that includes a base substrate, a processing device and a high-bandwidth memory device that are each integrated with the base substrate, and a package cooling device that is thermally coupled to the processing device and the high-bandwidth memory device. In some embodiments, the package cooling device includes a first heat spreader thermally coupled to an upper surface of the processing device, a second heat spreader thermally coupled to an upper surface of the high-bandwidth memory device, a thermoelectric cooling device positioned between and thermally coupled to a portion of the first heat spreader and the second heat spreader, and a heat exchanger thermally coupled to the first heat spreader.