Heterogeneous Package Cooling Layout for Die Hot Spots
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Solution Overview
Problem
The increasing performance of heterogeneous packages results in thermal management challenges due to complex configurations, higher power densities, and heat generation, which affect efficiency and reliability.
Innovation Solution
Implementing a matrix of dies separated by air channels with MEMS airflow devices that provide active cooling, directing airflow through inlets and outlets to remove heat from hot spots and optimize thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If heterogeneous integration is used to enhance functionality and improve operating characteristics, then product performance and speed are greatly improved, but heat generation increases and thermal management becomes more challenging
Solution Approach 1:
The patent divides the cooling function into multiple independent cooling devices distributed across the package substrate, with each cooling device serving specific die or hot spot areas. This segmentation allows targeted cooling of high-power regions without requiring uniform cooling across the entire package, effectively managing heat generation from high-speed heterogeneous integration.
Solution Approach 2:
The patent implements localized cooling by positioning cooling devices proximal to specific dies or hot spots rather than using a uniform cooling approach. Each cooling device is configured to direct airflow to specific air channels between adjacent dies, providing targeted thermal management where it is most needed while maintaining the high performance of the heterogeneous package.
2Adaptability or versatility
If multiple vertically stacked dies and adjacent die placements are used in heterogeneous packages, then functionality is enhanced, but thermal management complexity increases
Solution Approach 1:
The cooling system is segmented into multiple independent cooling devices, each with its own airflow control, rather than a single complex cooling system. This allows independent optimization of cooling for different die configurations and simplifies thermal management by treating each cooling zone separately.
Solution Approach 2:
The cooling devices are designed to serve multiple functions: they cool adjacent dies through air channels, can potentially cool vertically stacked dies through TSV structures, and can be positioned to address different thermal hot spots. This multi-functionality reduces overall thermal management complexity while supporting enhanced package functionality.
3Power
If higher power densities are achieved in heterogeneous packages, then performance is improved, but thermal management requirements become more stringent
Solution Approach 1:
Cooling devices are positioned proximal to high-power-density dies and configured to direct airflow specifically to air channels in those regions. This localized cooling approach effectively manages thermal hot spots generated by high power density while maintaining system reliability through targeted thermal management.
Solution Approach 2:
The patent incorporates temperature sensors that monitor thermal conditions and provide feedback to control the cooling devices. This feedback mechanism allows the system to dynamically adjust cooling in response to actual thermal conditions, ensuring reliable operation even at high power densities by preventing overheating of critical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management, improves product functionality, and increases reliability by providing localized and distributed cooling for heterogeneous packages.
Implementation Method 1
which may include a body with air inlets and air outlets, for which the body may house an air pump that may draw air in via the air inlets and push air out via the air outlets
Implementation Method 2
directing airflow into the air channels... to remove heat from hot spots and optimize thermal management
Data Source
AI summary
A present chip assembly may have a matrix of dies and cooling devices that may provide active cooling within a package. The cooling devices may provide airflow directed to spaces that are provided between dies placed on a support platform. The placement of the cooling devices may be optimized to provide active cooling at hot spot areas of the package.