Semiconductor Package Cooling Lid With Bonding Layer Heat Path
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Solution Overview
Problem
The miniaturization of semiconductor devices is hindered by heat dissipation issues during operation, which can decrease the reliability and lifetime of the die due to excessive heat generation.
Innovation Solution
A semiconductor device design incorporating a thermal conductive bonding layer, a lid with a plate portion and frame, and pillars or trenches to enhance heat dissipation, along with a backside metal layer and bonding patterns to improve thermal conductivity and reduce contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the die operates at high temperatures to maintain performance, then power delivery capability is improved, but reliability and lifetime of the die decrease
Solution Approach 1:
The patent introduces an intermediary cooling system between the power delivery die and the environment. This includes a cooling plate positioned adjacent to the die, with thermal conductive material filling the gap between them, and coolant channels within the cooling plate. The intermediary cooling mechanism allows the die to operate at high temperatures for power delivery while simultaneously removing excess heat to maintain reliability.
2Temperature
If thermal conductive material is applied to fill gaps between the die and cooling plate, then heat transfer is improved, but the complexity of assembly increases
Solution Approach 1:
The patent applies thermal conductive material to the cooling plate surface before assembling the die onto the cooling plate. This preliminary application ensures that when the die is placed, any gaps are automatically filled with the thermal conductive material, eliminating the need for separate gap-filling steps and simplifying the overall assembly process while maintaining effective heat transfer.
3Temperature
If the die is directly exposed to coolant, then heat dissipation is maximized, but the reliability of the die decreases due to coolant contact
Solution Approach 1:
The patent segments the cooling system into distinct functional zones: a first cooling region with the cooling plate and coolant channels for active heat removal, and a second cooling region adjacent to it. The die is positioned to receive heat from the first region while being protected from direct coolant contact, allowing heat dissipation through the thermal conductive material barrier while maintaining die reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by semiconductor dies, enhancing the reliability and longevity of the device by preventing coolant contact and optimizing heat transfer pathways.
Implementation Method 1
a thermal conductive bonding layer disposed on the semiconductor package and adapted to improve heat dissipation from the semiconductor package to the lid
Implementation Method 2
a plurality of pillars disposed on the semiconductor package, connected to the lid, and adapted to improve heat dissipation from the semiconductor die to the lid
Implementation Method 3
The lid may include a first cooling region... adapted to improve heat dissipation from the semiconductor package to an outer surface of the lid
Data Source
AI summary
A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.