Semiconductor Package Core Structure for Stiffness and Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges in achieving improved stiffness and heat dissipation while maintaining manufacturing simplicity and yield, as existing methods often complicate the process and increase costs by requiring separate structures for reinforcement.
Innovation Solution
A semiconductor package design featuring a core member and vertical connection conductor made from the same material, with tapered cross-sectional shapes, integrated into a redistribution substrate and encapsulant to enhance stiffness and heat dissipation, minimizing additional processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a separate structure (such as a printed circuit board) is embedded in the package to improve stiffness, then stiffness is improved, but manufacturing process complexity increases and costs increase
Solution Approach 1:
The patent merges the core member (for stiffness) and vertical connection conductors (for electrical connection) into a single integrated structure formed from one metal plate. This eliminates the need for separate embedding processes of distinct components, thereby improving stiffness while avoiding increased manufacturing complexity and costs.
2Strength
If a separate structure is embedded in the package to improve stiffness, then stiffness is improved, but manufacturing costs increase
Solution Approach 1:
The core member and vertical connection conductors are combined into a single integrated component formed from one metal plate, reducing the number of parts and assembly steps. This integration directly reduces manufacturing costs while maintaining the stiffness improvement.
3Strength
If a separate structure is embedded in the package to improve stiffness, then stiffness is improved, but package yield decreases due to fine foreign matter generated during processing
Solution Approach 1:
By forming the core member and vertical connection conductors as a single integrated structure from one metal plate, the patent eliminates multiple processing steps that would generate fine foreign matter. This reduces contamination risks and improves package yield while maintaining stiffness enhancement.
Data Source
AI summary
A semiconductor package includes a redistribution substrate including a first redistribution layer; a semiconductor chip having a connection pad connected to the first redistribution layer; a vertical connection conductor electrically connected to the connection pad by the first redistribution layer; a core member having a first through-hole accommodating the semiconductor chip and a second through-hole accommodating the vertical connection conductor; an encapsulant filling the first and second through-holes; and a redistribution member including a second redistribution layer. The vertical connection conductor and the core member include a same material. A width of a lower surface of the vertical connection conductor is wider than that of an upper surface thereof, a width of a lower end of the first through-hole is narrower than that of an upper end thereof, and a width of a lower end of the second through-hole is narrower than that of an upper end thereof.