Electronic Component Package Corner Frame Sealing for Airtightness

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Solution Overview

Problem

Existing electronic component packages face challenges in achieving a reliable airtight seal due to insufficient sealing material flow, which can lead to reduced airtightness and mechanical strength, particularly in designs where the molten sealing material does not adequately fill the recessed areas.

Innovation Solution

The electronic component package incorporates a lid, a first frame, a second frame, and a bonding member, with via wires electrically coupling the lid to the frames, ensuring that the inner diameter of the second frame's corner is larger than the first frame's, allowing the bonding member to protrude and form a secure seal, enhancing mechanical strength and airtightness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the sealing material is allowed to flow down the inner bottom surface through the inner wall, then the sealing material can reach the recessed area, but the sealing material may be insufficient in the sealing region and airtightness is reduced

Engineering Contradiction:
ImproveairtightnessVSAvoidsealing material quantity
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent applies preliminary action by pre-forming protruding portions on the inner wall of the base before sealing material application. These protrusions create predetermined flow paths that guide the molten sealing material to fill recessed areas first, ensuring proper distribution before the sealing region is compromised.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the base structure by adding protruding portions that divide the sealing path into controlled sections. This segmentation creates a stepped configuration that directs sealing material flow in a specific sequence, preventing premature depletion of sealing material in the sealing region.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the sealing material flows through the electrode to the exposed portion, then the recessed area can be filled, but the sealing material becomes insufficient in the sealing region

Engineering Contradiction:
Improvesealing material distributionVSAvoidairtightness
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies local quality by creating protruding portions at specific locations on the inner wall where sealing material flow needs to be controlled. These localized structural modifications alter the flow characteristics only in critical areas, allowing precise control over sealing material distribution without affecting the overall sealing region.

Inventive Principle:
Principle #3Local quality

3Strength

If the inner diameter of the first corner portion is smaller than the second corner portion, then the bonding member can form a secure seal, but the structural complexity increases

Engineering Contradiction:
Improvemechanical strengthVSAvoidframe structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent applies asymmetry by creating corner portions with different inner diameters (R1 < R2). This asymmetric configuration optimizes the bonding member seal formation at the first corner while maintaining structural integrity at the second corner, achieving enhanced mechanical strength through non-uniform geometry rather than uniform design.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures a reliable airtight seal and increased mechanical strength, reducing the likelihood of airtightness issues and allowing for the accommodation of larger integrated circuit elements while maintaining high oscillation characteristics of the resonator.

Implementation Method 1

a bonding member bonding the third layer to the lid

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

a via wire electrically coupled to the lid and penetrating the second frame

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

the molten sealing material stays in the exposed portion in a plan view due to surface tension

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS11811363B2Electronic component packages, electronic component, and oscillator
Publication Date: 2023.11.07 SEIKO EPSON CORP
  • US11811363B2 patent drawing
  • US11811363B2 patent drawing
  • US11811363B2 patent drawing

AI summary

An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1&lt;R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.