Semiconductor Package Structure With Crack-Blocking Protrusions

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Solution Overview

Problem

Semiconductor package structures are prone to cracking due to low rigidity and thermal processes, which can lead to warpage and damage the underfill between devices, potentially causing open circuits and reducing yield.

Innovation Solution

A package structure with a wiring structure, electronic devices, and a protection material that includes protrusion portions and fillers, where the protection material extends between the devices and the wiring structure, preventing cracks from propagating and enhancing the structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is attached to the semiconductor package structure to dissipate heat, then heat dissipation performance is improved, but pressing force is transmitted to the package structure causing cracks

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidcrack resistance

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The protrusion portion is formed on the electronic device before the heat sink is attached, creating a preventive structural feature that stops cracks at their source before they can propagate to the wiring structure

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The protrusion portion acts as an intermediary barrier between the heat sink and the wiring structure, intercepting and stopping crack propagation before it reaches the critical wiring structure

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the semiconductor package structure is subjected to thermal processes during manufacturing, then device assembly is achieved, but warpage occurs causing cracks in the underfill

Engineering Contradiction:

Improvedevice assemblyVSAvoidunderfill integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The protrusion portion is formed in advance on the electronic device, creating a preventive barrier that stops cracks before they can form or propagate in the underfill during thermal processes

Inventive Principle:

Principle #10Preliminary action

3Strength

If cracks propagate to the wiring structure, then structural damage occurs, but circuit functionality is compromised resulting in open circuits

Engineering Contradiction:

Improvestructural integrityVSAvoidcircuit functionality

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The protrusion portion serves as an intermediary barrier that intercepts crack propagation, preventing cracks from reaching the wiring structure and thus protecting circuit functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The protrusion portion converts the harmful crack propagation into a stopped defect, transforming what would be a catastrophic failure into a contained issue that does not affect circuit functionality

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS11894340B2Package structure and method for manufacturing the same

Publication Date: 2024.02.06 ADVANCED SEMICON ENG INC

AI summary

A package structure includes a wiring structure and a first electronic device. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The first electronic device is electrically connected to the wiring structure, and has a first surface, a second surface and at least one lateral side surface extending between the first surface and the second surface. The first electronic device includes a first active circuit region and a first protrusion portion. The first protrusion portion protrudes from the at least one lateral side surface of the first electronic device. A portion of the first active circuit region is disposed in the first protrusion portion.