Electronic Component Package Cutout Design for Capacitive Coupling Reduction
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Solution Overview
Problem
The existing electronic component housing packages face increased distance between leads and external circuit boards, leading to reduced capacity coupling and inability to dispose leads at high density without increased capacitance between adjacent leads.
Innovation Solution
The electronic component housing package incorporates cutout portions on the input/output member that extend from the gaps between wiring conductors to the outer surface, reducing capacitive coupling by interposing an air layer with a lower dielectric constant, allowing for closer wiring conductor placement and improved high-frequency properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If leads are disposed at high density, then integration density is improved, but capacitive coupling between adjacent leads increases
Solution Approach 1:
A dielectric member is introduced as an intermediary substance between adjacent leads to reduce capacitive coupling. The dielectric member has a lower dielectric constant than the surrounding medium, thereby acting as a mediator that reduces the harmful capacitive coupling effect while allowing high-density lead arrangement.
Solution Approach 2:
The dielectric member is selectively positioned only in specific regions where capacitive coupling needs to be reduced, rather than uniformly throughout the entire structure. This local application allows high-density lead disposal in areas where coupling reduction is critical, while maintaining integration density elsewhere.
2Object-affected harmful factors
If distance between leads and external circuit board is increased, then capacity coupling between leads and external circuit board is reduced, but package size increases
Solution Approach 1:
The dielectric member serves as an intermediary that reduces capacitive coupling between leads and the external circuit board without requiring increased distance. By placing the dielectric member with lower dielectric constant between the leads and board, the harmful capacity coupling is reduced while maintaining compact package dimensions.
3Quantity of substance
If leads are disposed at high density, then integration density is improved, but manufacturing precision requirements increase
Solution Approach 1:
The dielectric member is strategically positioned in specific locations between leads to reduce capacitive coupling, rather than requiring uniform precision control across all lead positions. This localized approach reduces the overall manufacturing precision requirements while still enabling high-density lead disposal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a compact package with enhanced high-frequency performance and closer wiring conductor spacing, reducing capacitive coupling and facilitating impedance matching, thereby achieving good electric properties and high integration density.
Implementation Method 1
capacity coupling created between adjacent leads via the dielectric base material cannot be largely reduced
Implementation Method 2
reducing capacitive coupling by interposing an air layer with a lower dielectric constant
Data Source
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AI summary
An electronic component housing package (10) includes a substrate (11) having an upper surface including a mount region (R) on which an electronic component (20) is to be mounted; a frame body (12) disposed on the upper surface of the substrate (11) so as to surround the mount region (R), the frame body being provided with a through-hole portion (H); and an input/output member (13) disposed on the frame body (12) so as to block the through-hole portion (H), the input/output member having a plurality of wiring conductors (131) which are to be electrically connected to the electronic component (20), the wiring conductors (131) extending to an inside and outside of the frame body (12) and also extending along a lower surface of the input/output member on the outside of the frame body (12). The input/output member (13) is provided with a cutout portion (C) which is cut out so as to extend from a gap between the plurality of wiring conductors (131) on the lower surface along the wiring conductors (131) to an outer side surface of the input/output member (13). It is possible to provide a compact electronic component housing package (10) which has good electric properties.