Semiconductor Package Dam Structure for Encapsulant Flow Control
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Solution Overview
Problem
The increasing demand for high-performance, high-speed, and multifunctional semiconductor devices requires finer patterns and smaller distances in semiconductor manufacturing, posing challenges in maintaining precise control over the encapsulant during the packaging process.
Innovation Solution
A semiconductor package design that incorporates a dam structure formed by a ground plate and a power plate on the substrate's lower surface, with a gap region between them, effectively prevents the encapsulant from flowing into the pad region by creating a barrier around the vent hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the degree of integration of semiconductor devices is increased to meet high performance and high speed demands, then functionality and processing speed are improved, but manufacturing precision and control over encapsulant flow deteriorate due to finer patterns and smaller distances
Solution Approach 1:
The encapsulant is segmented into multiple regions by the ground plate and power plate structures. The ground plate includes a first region, a second region, and a third region that are spatially separated and functionally distinct. This segmentation allows different portions of the encapsulant to be controlled independently, preventing uncontrolled flow while maintaining fine pitch configurations.
Solution Approach 2:
The ground plate and power plate structures act as intermediary elements between the encapsulant and the underlying substrate. These intermediary structures provide mechanical support and electrical isolation, enabling precise control of the encapsulant flow path while accommodating finer patterns required for high-speed processing.
2Adaptability or versatility
If finer patterns with smaller distances are implemented to increase integration, then device functionality is improved, but the risk of encapsulant flowing into pad regions increases
Solution Approach 1:
The ground plate and power plate structures are preliminarily positioned to define flow barriers before the encapsulant is fully formed. The first region of the ground plate extends to a first position, the second region extends to a second position, and the third region extends to a third position, creating predetermined boundaries that prevent encapsulant from flowing into pad regions during the packaging process.
Solution Approach 2:
Different regions of the ground plate are assigned different functional qualities. The first region provides electrical connection, the second region provides isolation, and the third region provides structural support. This local differentiation allows the structure to simultaneously enable fine pitch configurations and prevent encapsulant intrusion into sensitive pad areas.
Data Source
AI summary
A semiconductor package includes a substrate including lower pads and a vent hole, a semiconductor chip, an encapsulant including a through-portion filling the vent hole and an extension disposed adjacent to the through-portion, and a ground plate and a power plate disposed on a lower surface of the substrate. The lower surface of the substrate includes a first region including the vent hole, a pad region including the lower pads, and a second region between the first region and the pad region. The extension extends in a first horizontal direction in the first region. The ground plate and the power plate include at least one first protrusion disposed in the second region and extending in the first horizontal direction and at least one second protrusion extending in an opposite direction, respectively. The at least one first protrusion is disposed to engage with the at least one second protrusion.