Semiconductor Package Dam Structure for Moisture-Induced Peeling
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Solution Overview
Problem
The challenge in the semiconductor industry is to prevent the peeling off of die attach films that attach semiconductor chips to printed circuit boards, which affects the reliability and productivity of semiconductor packages.
Innovation Solution
A semiconductor package design that includes a dam structure surrounding the adhesive member between the semiconductor chip and the package substrate, with a height greater than or equal to the adhesive member, to suppress moisture absorption and enhance reliability and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a die attach film is used to attach the semiconductor chip to the package substrate, then the semiconductor chip can be securely mounted, but the adhesive member may absorb moisture and peel off over time
Solution Approach 1:
The patent introduces a dam structure as an intermediary element between the adhesive member and the external environment. This dam acts as a barrier that mediates the interaction between moisture and the adhesive member, preventing moisture from reaching the adhesive while maintaining the bonding function. The dam is formed around the adhesive member and extends to prevent moisture penetration, thus protecting the bonding interface without interfering with the attachment function.
Solution Approach 2:
The patent segments the protective function by introducing a separate dam structure distinct from the adhesive member itself. Rather than relying solely on the adhesive member's properties, the protection against moisture is divided into a separate structural element (the dam) that surrounds and protects the adhesive member. This segmentation allows the adhesive member to focus on bonding while the dam handles moisture protection.
2Ease of manufacture
If the adhesive member is exposed to moisture, then moisture can penetrate to the bonding interface, but preventing exposure requires additional protective structures
Solution Approach 1:
The patent applies preliminary action by forming the dam structure around the adhesive member before final assembly and testing. This preventive measure is built into the manufacturing process itself, creating a protective barrier in advance that prevents moisture penetration issues from developing later. The dam is formed as part of the package substrate structure prior to chip attachment, ensuring protection is already in place before the product enters service.
3Reliability
If the dam height is less than the adhesive member height, then the manufacturing process is simpler, but moisture can still reach the adhesive member side surfaces
Solution Approach 1:
The patent applies local quality by making the dam height equal to or greater than the adhesive member height specifically at the critical regions where moisture penetration would occur. Rather than uniformly increasing the complexity of the entire structure, the dam is designed with sufficient height only where needed to protect the adhesive member's side surfaces from moisture, while maintaining simplicity in other areas of the package structure.
Data Source
AI summary
A semiconductor package includes: a package substrate that includes a substrate pad; a semiconductor chip that is disposed on the package substrate, the semiconductor chip including a chip pad; a bonding wire that connects the substrate pad to the chip pad; an adhesive member between the package substrate and the semiconductor chip; and a dam that extends along a side surface of the adhesive member and surrounds at least some of side surfaces of the adhesive member. A height of the dam is greater than or equal to a height of the adhesive member.