Electronic Package Dam Structure Underfill Confinement
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Solution Overview
Problem
Three-dimensional electronic packages, such as package on package (POP), face issues with large thickness and underfill bleeding due to their stacking structure, which can lead to warpage and reliability concerns in electrical connections.
Innovation Solution
The electronic package incorporates a dam structure to confine the underfill and a cavity in the second conductive structure to accommodate the electronic component, preventing underfill bleeding and reducing overall thickness, while optionally including a stress compensation layer to address warpage issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a stacking structure is used to achieve three-dimensional packaging, then the integration density is improved, but underfill bleeding and warpage issues occur
Solution Approach 1:
The patent introduces a dam structure that segments the packaging space into distinct regions, confining the underfill within a specific area and preventing it from bleeding into unwanted regions. This segmentation approach directly addresses the underfill bleeding issue while maintaining the stacking structure for high integration density.
Solution Approach 2:
The dam structure provides localized confinement properties at specific areas where underfill needs to be controlled. By applying the confinement function locally at the dam structure rather than throughout the entire package, the patent prevents underfill bleeding without compromising the overall stacking structure.
2Productivity
If a stacking structure is used to achieve three-dimensional packaging, then the integration density is improved, but warpage issues occur
Solution Approach 1:
The stress compensation layer acts as a counterweight to balance the internal stresses generated by the stacking structure. By introducing this layer with appropriate mechanical properties, the patent compensates for the warpage tendency and maintains package stability while achieving high integration density through stacking.
3Reliability
If underfill is applied to fill gaps between components, then the electrical connection reliability is improved, but underfill bleeding contaminates electrical interconnection
Solution Approach 1:
The dam structure segments the packaging space to create a confined region for underfill application. This segmentation allows the underfill to provide electrical connection reliability within the intended area while preventing it from bleeding into regions where it would cause contamination of electrical interconnections.
Solution Approach 2:
The dam structure serves as an intermediary barrier between the underfill and the electrical interconnection regions. It mediates the interaction by allowing the underfill to perform its function of improving electrical connections while blocking it from causing harmful contamination in adjacent areas.
Data Source
AI summary
An electronic package and method for manufacturing the same are provided. The electronic package includes a first conductive structure, a second conductive structure, an electronic component, an underfill and a dam structure. The second conductive structure is disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure. The electronic component is disposed on the first conductive structure and at least partially disposed in the cavity. The underfill is disposed between the first conductive structure and the electronic component. The dam structure is disposed on the first conductive structure and configured to confine the underfill.