Package Device Shielding Path for EMI Reduction and Thermal Management
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Solution Overview
Problem
Conventional package devices face challenges in effectively dissipating heat and managing electromagnetic/radio frequency interference, leading to reduced performance and increased costs due to inadequate heat dissipation and interference shielding capabilities.
Innovation Solution
A package device design featuring a substrate with a metal plate and insulating layer, through holes with conductors, and side connecting structures to discharge electromagnetic/radio frequency interference to the grounded, while also incorporating lead-frames and a heat dissipation apparatus to enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal sheet is used as shielding structure, then electromagnetic/radio frequency interference is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The shielding structure is segmented into multiple metal layers (first metal layer and second metal layer) separated by insulating layers, allowing electromagnetic interference shielding while enabling heat dissipation paths through the segmented structure
Solution Approach 2:
The shielding structure uses composite material construction with alternating metal layers and insulating layers, combining the electromagnetic shielding properties of metal with the thermal management properties of the composite structure
2Temperature
If a single insulating layer is used as shielding structure, then heat dissipation is improved, but electromagnetic/radio frequency interference shielding deteriorates
Solution Approach 1:
The shielding structure uses composite material construction with alternating metal layers and insulating layers, combining the electromagnetic shielding properties of metal with the thermal management properties of the composite structure
3Adaptability or versatility
If conventional separating apparatus with power devices is used, then functionality is achieved, but electromagnetic/radio frequency interference is generated
Solution Approach 1:
The harmful electromagnetic/radio frequency interference generated by the separating apparatus is extracted and directed to dedicated discharge paths, separating the interference discharge function from the normal operational pathways
4Object-affected harmful factors
If electromagnetic/radio frequency interference is discharged through printed circuit board to grounded, then interference is reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The shielding structure is integrated directly with the substrate, merging the interference discharge function into the substrate structure itself rather than requiring separate printed circuit board pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases power density and immunity to electromagnetic interference, improves heat dissipation, and reduces manufacturing complexity and costs by constructing a shielding path that discharges interference and dissipates heat efficiently.
Implementation Method 1
a metal plate 102 which is formed above the bottom surface of the substrate (10/11), wherein the metal plate (102) forms a shielding structure for discharging an electromagnetic/radio frequency interference
Implementation Method 2
a through hole with the conductor therein that located between the substrate with/without wirings and metal plate to conduct the electricity between the substrate with/without wirings and metal plate
Implementation Method 3
a heat dissipation apparatus to enhance thermal management
Implementation Method 4
The heat is dissipated via the heat dissipation apparatus 118 for the package device
Data Source
AI summary
The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.