Package Device Simulator Using Composite Substrate and Conductive Traces
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Solution Overview
Problem
The high cost and complexity of manufacturing solid metallic package device simulators for testing semiconductor chips lead to inefficient testing processes, as they are expensive, require long lead times, and cannot perform multiple tests simultaneously due to electrical interconnections.
Innovation Solution
A package device simulator is constructed using a non-conductive rigid substrate with multiple layers of electrically conductive traces, sealed between non-conductive substrates with openings for conductive binding material and contact balls, which are cured and coated with hardening materials like Nickel and Gold, allowing for electrical isolation and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solid metallic package device simulators are used, then high-quality electrical connections and durability are achieved, but manufacturing costs and lead times increase significantly
Solution Approach 1:
The patent applies composite materials by combining a non-conductive substrate with conductive trace layers and contact balls. This composite structure replaces solid precious metals while maintaining electrical connection quality. The non-conductive substrate provides mechanical support, the conductive traces provide electrical pathways, and the contact balls provide connection points, collectively achieving the same function as solid metal at lower cost.
Solution Approach 2:
The patent segments the monolithic solid metal simulator into distinct functional layers: a non-conductive substrate base, conductive trace patterns, and separate contact balls. This segmentation allows each component to be optimized independently and manufactured using different, more cost-effective processes rather than requiring expensive solid metal machining.
2Duration of action of stationary object
If solid metallic package device simulators are used, then durability and ease of cleaning are achieved, but manufacturing complexity and lead times increase
Solution Approach 1:
The composite structure combines materials optimized for different functions: the non-conductive substrate provides mechanical durability and cleanability, while the conductive traces and contact balls provide electrical functionality. This allows each material to be selected for its optimal properties rather than requiring a single metal material to satisfy all requirements.
Solution Approach 2:
Different regions of the simulator have different properties tailored to their specific functions. The substrate areas require mechanical strength and cleanability, the trace areas require electrical conductivity, and the contact ball areas require both electrical conductivity and mechanical durability. This local optimization enables using less expensive materials overall while maintaining high performance where needed.
3Reliability
If conventional package device simulators are used, then electrical connections are established, but multiple simultaneous tests cannot be performed due to electrical interconnections
Solution Approach 1:
The patent segments the electrical connections into isolated trace regions on the non-conductive substrate. By providing electrical isolation between different contact ball regions through the non-conductive material and trace design, multiple tests can be performed simultaneously without electrical interference, thereby increasing testing throughput while maintaining reliable connections.
4Use of energy by moving object
If precious metals are used for package device simulators, then high electrical conductivity is achieved, but raw material costs become extremely high
Solution Approach 1:
The patent uses composite materials where conductive traces and contact balls are applied as thin layers or small discrete elements on a non-conductive substrate. This approach uses significantly less conductive material compared to solid metal simulators, dramatically reducing the quantity of expensive precious metals required while maintaining adequate electrical conductivity for testing purposes.
Solution Approach 2:
The patent changes the physical form and distribution of conductive material from bulk solid metal to thin trace layers and small contact balls. This parameter change reduces the total volume and mass of expensive conductive material needed while maintaining the electrical conductivity performance required for effective chip testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs and lead times, enables high-quality connections, and allows for simultaneous performance of multiple tests by providing electrical isolation between contacts, improving the efficiency and durability of the testing process.
Implementation Method 1
Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces
Implementation Method 2
the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold
Data Source
AI summary
An improved package device simulator for the testing of testing sockets, the package device simulator being formed of a first layer of non-conductive rigid substrate with a second layer formed of a plurality of electrically conductive traces being added thereto. A third layer of non-conductive rigid substrate is adhered to the first layer with the second layer being sealed there between. The third layer having a plurality of openings therein, wherein the openings align with and expose a portion of the electrically conductive traces of the second layer. Conductive binding material and contact balls are added to the openings and the chip is cured thereby fusing the contact balls with the exposed portions of the traces. Next, the exposed surfaces are coated with a hardening conductive material, such as layers of Nickel and/or Gold. In this way an improved package device simulator is formed that is durable, easier to manufacture and less expensive than a solid metallic package device simulator.