Package Bonding Interface with Dummy Pads to Suppress Bond Waves

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Solution Overview

Problem

Integrated circuit packages face issues with fast bond wave propagation during bonding processes, leading to formation of tiny bulges and non-bond regions, which affect manufacturing quality and efficiency.

Innovation Solution

The introduction of dummy bond pads within the carrier, which are formed using a damascene process and penetrate through the dielectric layer, disrupts the bond wave propagation by altering its speed and direction, thereby reducing bulges and improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If bonding process is performed without dummy bond pads, then bonding speed is maintained, but bond wave propagation causes tiny bulges and non-bond regions reducing manufacturing quality

Engineering Contradiction:

Improvebonding qualityVSAvoidbonding speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

Dummy bond pads are introduced as intermediary elements between the bonding interface and the bond wave propagation path. These dummy pads act as mediators that disrupt and slow down the bond wave, preventing the formation of harmful bulges and non-bond regions while maintaining overall bonding efficiency

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding process parameters are modified by introducing dummy bond pads that change the physical characteristics of the bonding interface. This alters the bond wave propagation speed and distribution, transforming the bonding dynamics to achieve better quality without significant productivity loss

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If dummy bond pads are introduced to reduce bond wave propagation, then manufacturing quality improves, but device complexity increases

Engineering Contradiction:

Improvebonding qualityVSAvoidpackage structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Dummy bond pads are strategically placed only in specific locations where bond wave disruption is needed, rather than uniformly across the entire device. This localized approach improves bonding quality in critical areas while minimizing the overall increase in device complexity

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The bonding interface is segmented into functional bonding areas and dummy pad areas. This segmentation allows the dummy bond pads to be treated as separate, modular elements that can be independently designed and positioned to optimize quality without complicating the entire device structure

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250323188A1Packages with reduced bond wave propagation and the methods of forming the same

Publication Date: 2025.10.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes forming a composite carrier comprising forming a first dielectric layer on a carrier, and forming a plurality of metal pads in the first dielectric layer. The formation of the plurality of metal pads includes performing a planarization process to level first surfaces of the plurality of metal pads and the first dielectric layer. A reconstructed wafer is formed to include a plurality of device dies, and a second dielectric layer on the plurality of device dies. The composite carrier is bonded to the reconstructed wafer, and the plurality of metal pads physically contact the second dielectric layer.