Semiconductor Package Encapsulant with CNF-2D Thermal Network

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The increasing power density in semiconductor devices requires advanced packaging systems that effectively manage heat and maintain electrical integrity, as existing materials struggle to provide sufficient thermal conductivity and mechanical properties for compact 3D electronics.

Innovation Solution

A composite material is formed by premixing cellulose nanofibrils (CNFs) with thermally conductive 2D materials like hexagonal boron nitride (h-BN) and graphene, followed by compounding with a polymeric material, to create a network that enhances thermal conductivity and electrical insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If existing materials are used for packaging, then manufacturing simplicity is maintained, but thermal conductivity and mechanical properties are insufficient for compact 3D electronics

Engineering Contradiction:

Improvethermal conductivityVSAvoidmaterial composition complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent applies composite materials by combining cellulose nanofibrils (CNFs) with thermally conductive two-dimensional materials (such as hexagonal boron nitride or graphene) to create a hybrid filler system. This composite approach enables the packaging material to achieve superior thermal conductivity and mechanical properties that cannot be obtained with conventional single-material systems, directly resolving the contradiction between maintaining manufacturing simplicity and achieving enhanced thermal performance.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent employs parameter changes by systematically optimizing the weight ratios of different fillers (CNFs and 2D materials) within the polymer matrix. By adjusting these compositional parameters, the invention achieves peak thermal conductivity and mechanical strength while maintaining processability, thus resolving the contradiction between enhanced thermal properties and material complexity.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If integration density is increased by reducing feature size, then more components are integrated into a given area, but heat management becomes more challenging

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent uses composite materials comprising cellulose nanofibrils combined with thermally conductive two-dimensional materials to create a packaging system capable of managing heat in high-density integrated circuits. The synergistic combination of these materials provides both the mechanical integrity needed for miniaturization and the thermal conductivity required to dissipate heat from densely packed components.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by creating regions of high thermal conductivity within the packaging material through the strategic distribution of thermally conductive 2D materials and CNFs. This allows heat to be efficiently conducted away from critical high-density circuit regions while maintaining the overall structural integrity of the packaging system.

Inventive Principle:

Principle #3Local quality

3Temperature

If composite material with multiple fillers is used, then thermal conductivity is enhanced, but manufacturing process complexity increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidprocessing simplicity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by pre-mixing cellulose nanofibrils and thermally conductive two-dimensional materials to form a homogeneous composite filler system before incorporating it into the polymer matrix. This pre-preparation step ensures uniform distribution of fillers and simplifies subsequent processing, thereby enhancing thermal conductivity without proportionally increasing manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite material improves thermal conductivity and dielectric properties, reducing noise and power loss while providing effective heat management and protection against moisture and electromagnetic interference, suitable for high-density semiconductor packaging.

Implementation Method 1

a first material network in the first polymeric material, wherein the first material network comprises first cellulose nanofibrils and a first two-dimensional material, and the first two-dimensional material has an in-plane thermal conductivity greater than a thermal conductivity of the first polymeric material

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The composite material improves thermal conductivity and dielectric properties, reducing noise and power loss

Methodology Applied

Scientific EffectDielectric properties: Dielectric

Data Source

PatentUS20250364338A1Package structure and method for fabricating the same

Publication Date: 2025.11.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a die and a first encapsulant. The first encapsulant surrounds the die. The first encapsulant includes a first polymeric material and a first material network in the first polymeric material. The first material network comprises a first cellulose nanofibrils (CNFs) and a first 2D material, and the first 2D material has an in-plane thermal conductivity greater than a thermal conductivity of the first polymeric material.