Semiconductor Package Encapsulation Without a Keep-Out Zone
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Solution Overview
Problem
Conventional semiconductor packaging processes are complex and costly, requiring multiple steps and a high risk of process control issues, with underfill filling and molding processes separately performed, and the need for a keep out zone around the die to prevent underfill layer contact with through vias, which increases complexity and package size.
Innovation Solution
A semiconductor package manufacturing process that integrates encapsulation of dies and bridge dies using a single encapsulant material, eliminating the need for a keep out zone, with a dispensing process to form an encapsulant layer that encapsulates sidewalls and top surfaces, and a planarization process to expose connectors, reducing process steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate underfill filling and molding processes are performed, then encapsulation reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the underfill filling process and molding process into a single integrated encapsulation process. The encapsulant material simultaneously performs the functions of underfill (filling gaps between die and substrate) and molding (encapsulating the entire assembly), eliminating the need for separate process steps while maintaining reliable encapsulation of through vias and connectors.
2Reliability
If a keep out zone is maintained around the die, then underfill layer contact with through vias is prevented, but package size and manufacturing complexity increase
Solution Approach 1:
The patent extracts and eliminates the keep out zone requirement by using an encapsulant material with controlled viscosity and curing characteristics. The encapsulant is dispensed in a manner that allows it to fill gaps and encapsulate through vias without requiring a predetermined exclusion zone around the die, thereby reducing package area while maintaining via contact prevention through proper material selection and process control.
3Manufacturing precision
If multiple process steps are used for encapsulation, then encapsulation quality is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent applies preliminary action by pre-formulating the encapsulant material with optimal viscosity, flow characteristics, and curing properties before the encapsulation process. The encapsulant is prepared in advance to self-level and properly fill gaps between components, eliminating the need for multiple sequential process steps such as separate underfill application, curing, and molding operations, thereby reducing manufacturing cycle time while maintaining encapsulation quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated process simplifies the manufacturing flow, reduces costs, and improves yield by eliminating the need for a keep out zone and separate underfill and molding processes, while ensuring reliable encapsulation of through vias and bridge dies.
Implementation Method 1
A dispensing process is performed to form an encapsulant layer encapsulating sidewalls and top surfaces of the first die, the second die, and the first encapsulant
Implementation Method 2
The encapsulant material layer is formed to fill a space between the bridge die and the first die, between the bridge die and the first encapsulant, and between the bridge die and the second die
Data Source
AI summary
Package structure and method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a third die, and a second encapsulant. The first die and the second die laterally aside the first die. The first encapsulant laterally encapsulates the first die and the second die. The third die is electrically connected to the first die and the second die. The second encapsulant is over the first die, the second die and the first encapsulant, laterally encapsulating the third die. The first encapsulant includes a plurality of first fillers, the second encapsulant includes a plurality of second fillers, and a content of the second fillers in the second encapsulant is less than a content of the first fillers in the first encapsulant.