Electronic Package Encapsulation Layout for Connector Warpage Control
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Solution Overview
Problem
Conventional 5G Antenna-in-Packages (AiP) suffer from structural asymmetry and warpage due to unbalanced encapsulation, leading to unreliable board-to-board connectors.
Innovation Solution
An electronic package design with a substrate having distinct regions, where both regions are reinforced by an encapsulant layer extending across the substrate, exposing at least one component, and optionally including a shielding layer for improved structural integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If partial shielding technology is utilized with unbalanced encapsulation, then board-to-board connectors can be connected to external devices, but the substrate experiences unbalanced warpage and connector detachment occurs
Solution Approach 1:
The patent applies asymmetry in reverse by creating a symmetrical encapsulation structure. The encapsulant layer is configured to extend across both first and second regions of the substrate with substantially equal thickness, balancing the structural support on both sides of the substrate. This symmetrical design counteracts the unbalanced warpage that would otherwise occur with partial encapsulation, while still leaving the second region accessible for connector connections.
Solution Approach 2:
The patent changes the encapsulation parameter by extending the encapsulant layer into the second region where connectors are located, rather than completely excluding it. The encapsulant layer is configured to expose the connectors while providing structural reinforcement, thus changing the encapsulation extent parameter to achieve both connector accessibility and substrate stability.
2Ease of operation
If the second region is left non-encapsulated for connector access, then connectors can be connected to external devices, but the non-encapsulated region becomes prone to warpage
Solution Approach 1:
The patent applies local quality by providing differentiated encapsulation coverage. The first region is fully encapsulated for component protection, while the second region has partial encapsulation that exposes connectors but provides sufficient structural support. This localized quality variation achieves both connector accessibility and substrate stability.
Solution Approach 2:
The patent uses controlled asymmetry in the encapsulation design. The encapsulant layer extends across both regions but with different configurations - fully covering the first region with components, and partially covering the second region with connectors. This controlled asymmetrical approach maintains substrate flatness while enabling connector access.
3Ease of manufacture
If conventional partial encapsulation is used, then manufacturing is simplified, but structural balance and reliability are compromised
Solution Approach 1:
The patent applies universality by making the encapsulant layer serve multiple functions simultaneously. It provides component protection in the first region, structural reinforcement across both regions to prevent warpage, and selective exposure of connectors in the second region. This multi-functional encapsulation design achieves high reliability while maintaining manufacturing simplicity through a single encapsulation process.
Data Source
AI summary
An electronic package comprises: a substrate comprising a first region and a second region adjacent to the first region in a lengthwise direction of the substrate; a first electronic component mounted on the substrate in the first region; a second electronic component mounted on the substrate in the second region, wherein the second electronic component does not occupy an entirety of the substrate in a widthwise direction of the substrate; and an encapsulant layer formed on the substrate, wherein at least the second electronic component is exposed from the encapsulant layer, and wherein the encapsulant layer extends from the first region to the second region to reinforce the substrate in both the first region and the second region.