Semiconductor Package Fixture Footing Structure for Lid Rigidity
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Solution Overview
Problem
The presence of an opening in the fixture for accessing the connector reduces the structural rigidity of the lid component, leading to warpage and increased effective thermal resistance, which in turn reduces the performance of IC dies in a semiconductor die package.
Innovation Solution
The implementation of footing structures connected to an interposer using epoxy deposits increases the structural rigidity of the fixture, maintaining the position of the lid component and ensuring compression of the thermal interface material, thereby enhancing thermal performance and circuitry compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If openings are provided in the lid component for connector access, then ease of operation is improved, but structural rigidity deteriorates
Solution Approach 1:
The lid component is segmented into multiple sections: a main body portion and one or more support portions that extend toward the interposer. This segmentation allows the main body to have openings for connector access while the support portions provide additional structural reinforcement to maintain overall rigidity.
Solution Approach 2:
The support portions are strategically positioned in specific locations where structural reinforcement is most needed. These localized additions provide rigidity enhancement precisely where the openings create weakness, without adding unnecessary material throughout the entire lid component.
2Reliability
If structural rigidity is increased to maintain thermal performance, then thermal resistance is improved, but device complexity increases
Solution Approach 1:
The support portions are integrated directly into the lid component as a unified structure rather than being separate attachments. This merging approach maintains thermal performance through improved structural rigidity while avoiding the complexity of additional discrete components and assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased structural rigidity and retention forces provided by epoxy deposits maintain thermal performance thresholds, ensuring the IC dies meet computing speed and refresh rate requirements while prolonging the useful life of the semiconductor die package.
Implementation Method 1
The footing structures may be connected to the interposer using deposits of an epoxy material
Implementation Method 2
a thermal interface material (TIM) may be located between the one or more IC dies and a lid component of the fixture
Data Source
AI summary
Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.