Package Flat Substrate Splitting for Size Adaptability
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Solution Overview
Problem
Existing automated package customization systems face challenges in accommodating varied desired package sizes, often resulting in wasted space or inability to fit structures on available substrates, as they are limited by a fixed set of substrate sizes.
Innovation Solution
A system that generates package design files with programming instructions for cutting and creasing devices to identify optimal cut and fold lines, allowing for the arrangement of three-dimensional structures across multiple substrates, including the option to split structures into parts that fit on available substrates without adversely affecting functional connections or ease of assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed set of substrate sizes is used in production, then manufacturing simplicity is maintained, but the ability to accommodate varied package sizes is limited
Solution Approach 1:
The patent divides a large substrate into multiple smaller substrate regions, each capable of holding a complete or partial package flat. This segmentation allows the system to use a limited set of substrate sizes while accommodating varied package sizes by strategically assigning package flats to different substrate regions.
Solution Approach 2:
The patent transitions from a single-substrate two-dimensional layout to a multi-substrate three-dimensional arrangement. Package flats can be distributed across multiple substrates stacked or arranged in space, effectively adding a vertical or spatial dimension to the layout problem.
2Loss of substance
If desired package structures are forced to fit on available substrates, then substrate utilization is maximized, but significant wasted space occurs
Solution Approach 1:
The patent implements a dynamic assignment system where package flats are flexibly allocated to substrate regions based on real-time substrate availability and package flat dimensions. This dynamic approach optimizes substrate utilization by matching package requirements with substrate capacities, minimizing wasted space while maintaining manufacturing precision.
3Loss of substance
If package flats are split across multiple substrates, then substrate space efficiency is improved, but functional connections and assembly ease may be adversely affected
Solution Approach 1:
The patent introduces substrate regions as intermediaries that contain complete functional connections or logical groups of package flats. By ensuring that each substrate region maintains functional integrity, the system minimizes the impact of splitting package flats across multiple substrates while still achieving space efficiency.
4Productivity
If automated package customization is implemented, then productivity is improved, but the system cannot accommodate packages larger than available substrates
Solution Approach 1:
The patent creates a universal substrate system where a limited set of substrate sizes can serve multiple package size requirements through flexible region assignment and multi-substrate arrangements. This universal approach maintains automated customization efficiency while expanding the range of accommodatable package sizes.
Data Source
AI summary
A package design system creates one or more package design files by creating cut line instructions and fold line instructions for a package flat. If the system determines that the package flat should be split into two or more subparts across two or more substrates or two or more sub-regions of a single substrate, it will select a fold line and convert the selected fold line to a seam. Conversion to a seam may occur by creating cut line instructions for the selected fold line, imparting a first set of functional elements on a first side of the seam, and imparting a second set of functional elements on a second side of the seam. The first set of functional elements and the second set of functional elements will form a functional connection when the three-dimensional structure is formed.