Electronic Component Package Flow Path Guide Design

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Solution Overview

Problem

Existing electronic component packages, such as DC-to-DC converters in hybrid vehicles, face inefficiencies in cooling due to the generation of eddies and bubbles in the cooling water flow, which lowers cooling performance.

Innovation Solution

The package includes a housing with a flow path featuring a first region connected to an inlet and a second region connected to an outlet, where the first region has a tapered portion that becomes bent, and a guide with varying width to control the flow speed and rate, reducing eddies and bubbles by dividing the cooling water flow uniformly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling water is circulated at high pressure to improve cooling efficiency, then cooling performance is enhanced, but eddies and bubbles are generated which lowers cooling efficiency

Engineering Contradiction:
Improvecooling efficiencyVSAvoideddies and bubbles
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The flow path is divided into multiple regions (first region with inlet, second region with outlet, and intermediate regions) with different structural characteristics. Each region has specific tapered portions and guides that segment the cooling water flow into controlled streams, preventing chaotic eddies while maintaining high-pressure cooling efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the flow path have different geometric properties - the first region has a first tapered portion with specific curvature, the second region has a second tapered portion, and guides with varying widths are placed at specific locations. These local structural variations optimize flow characteristics at each location to eliminate eddies and bubbles while maintaining overall cooling performance

Inventive Principle:
Principle #3Local quality

2Temperature

If cooling water flows uniformly to improve cooling performance, then heat dissipation is enhanced, but flow uniformity is difficult to achieve without creating eddies

Engineering Contradiction:
Improvecooling performanceVSAvoidflow uniformity
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The first tapered portion in the first region preliminarily conditions the cooling water flow before it enters the main flow path. This preliminary tapering action smooths the flow and prevents eddy formation at the inlet, establishing uniform flow conditions that are maintained throughout the subsequent flow path

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Guides with varying widths act as intermediary structures between different flow regions. These guides mediate the transition of cooling water between regions, controlling flow distribution and maintaining uniformity while preventing the formation of eddies and bubbles that would disrupt stable flow

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances cooling efficiency by controlling the flow of cooling water, reducing eddies and bubbles, thereby improving the thermal management of electronic components.

Implementation Method 1

the first region includes a guide, and the guide includes a region of which a width increases as a distance from the inlet to the guide increases

Methodology Applied
Scientific EffectFluid flow control:

Implementation Method 2

the first tapered portion become bent so that a distance from the second region to the first tapered portion increases

Methodology Applied
Scientific EffectEddy reduction:

Data Source

PatentUS11477922B2Electronic component package
Publication Date: 2022.10.18 LG INNOTEK CO LTD
  • US11477922B2 patent drawing
  • US11477922B2 patent drawing
  • US11477922B2 patent drawing

AI summary

An embodiment discloses an electronic component package comprising: a housing including a flow path arranged on one surface thereof; and an inlet and an outlet arranged on the housing, wherein the flow path includes a first area connected with the inlet and a second area connected with the outlet, the first area includes a guide, and the guide includes an area of which the width gradually widens from the inlet.