Package Structure Footing Portion Adhesion
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving efficient and reliable testing and packaging of 3D integrated circuit devices due to limitations in current testing methodologies and packaging technologies, which affect yield and cost.
Innovation Solution
The method involves forming a package structure with a die, an encapsulant, a redistribution layer (RDL) structure, and conductive terminals, where test pads are used for verification testing and then removed to avoid solder residue issues, and a seed layer and conductive pillars are used to create connectors with a footing portion for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If test pads are retained for verification testing, then testing reliability is improved, but solder residue defects occur
Solution Approach 1:
The patent removes test pads after verification testing is completed. The test pads are extracted from the final package structure, eliminating the source of potential solder residue defects while having served their testing purpose
Solution Approach 2:
Verification testing is performed on the test pads before the final packaging process. This preliminary action allows testing to be completed while the test pads are still present, before they are removed to avoid solder residue issues
2Ease of manufacture
If conventional packaging methods are used, then manufacturing simplicity is maintained, but yield and reliability are reduced
Solution Approach 1:
The seed layer is formed with a footing portion that protrudes from the sidewall of the conductive pillar before the final packaging process. This preliminary formation of the footing portion ensures proper adhesion and wettability for subsequent encapsulant application, improving reliability while maintaining manufacturing flow
Solution Approach 2:
The seed layer is designed with non-uniform geometry, featuring a footing portion that extends beyond the conductive pillar sidewall. This local geometric variation creates enhanced adhesion zones specifically where the encapsulant will contact, improving local bonding quality without affecting the overall manufacturing process
3Productivity
If smaller feature sizes are used to increase integration density, then component integration is improved, but packaging complexity increases
Solution Approach 1:
The connection structure is segmented into distinct functional zones: the conductive pillar for electrical connection and the footing portion for mechanical adhesion. This segmentation allows each component to be optimized independently for its specific function, simplifying the overall packaging design despite small feature sizes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and performance of the package structure by improving wettability and adhesion, reducing defects, and increasing yield while avoiding potential issues from solder residue, thus addressing the limitations of existing testing and packaging methods.
Implementation Method 1
The seed layer includes a footing portion that laterally protrudes from a sidewall of the conductive pillar, thereby improving wettability and adhesion
Data Source
AI summary
A package structure, a die and method of forming the same are provided. The package structure includes a die, an encapsulant, a RDL structure, and a conductive terminal. The die has a connector. The connector includes a seed layer and a conductive on the seed layer. The seed layer extends beyond a sidewall of the conductive pillar. The encapsulant is aside the die and encapsulates sidewalls of the die. The RDL structure is electrically connected to the die. The conductive terminal is electrically connected to the die through the RDL structure.