Electronic Package Frame Groove for Crack and Short Prevention
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Solution Overview
Problem
The miniaturization of electronic devices has led to issues with cracking between the frame section and through conductors, as well as electrical short-circuiting due to reduced frame sizes and protruding connecting materials, which compromise the reliability and compactness of electronic devices.
Innovation Solution
A package design featuring an insulating base with a frame section, an electrode pad on the upper surface, a first wall conductor at the inner wall's upper end for electrical connection, and a wiring conductor embedded within the frame for electrical connection, reducing the likelihood of cracking and short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the frame section width is reduced to downsize the electronic device, then the electronic device becomes more compact, but cracking occurs between the through conductor and the frame section wall surface
Solution Approach 1:
A groove is formed in the frame section at a position overlapping with the through conductor in the thickness direction. This groove acts as an intermediary structure that relieves stress concentration between the through conductor and the frame section wall surface, preventing crack occurrence while enabling miniaturization of the electronic device.
2Volume of moving object
If the frame section width is reduced to downsize the electronic device, then the electronic device becomes more compact, but electrical short-circuiting occurs between the electronic element and the wiring conductor
Solution Approach 1:
The groove formed in the frame section serves as an intermediary isolation structure between the electronic element and the wiring conductor. This groove prevents direct contact between connecting material and the wiring conductor, thereby eliminating the risk of electrical short-circuiting while allowing closer arrangement of components for device miniaturization.
3Volume of moving object
If the opening of the frame section is reduced to downsize the electronic device, then the electronic device becomes more compact, but the connecting material protrudes outside the electronic-element mounting region and contacts the inner wall of the frame section
Solution Approach 1:
The groove in the frame section acts as an intermediary containment structure for the connecting material. This groove provides a designated space that accommodates the connecting material, preventing it from protruding outside the electronic-element mounting region and contacting the inner wall of the frame section, thus maintaining manufacturing precision in miniaturized devices.
4Volume of moving object
If the opening of the frame section is reduced to downsize the electronic device, then the electronic device becomes more compact, but wiring conductors must be arranged in closer proximity increasing short-circuiting risk
Solution Approach 1:
The groove structure in the frame section serves as an intermediary barrier between adjacent wiring conductors. This groove prevents connecting material from bridging between closely spaced wiring conductors, enabling safer arrangement of wiring conductors in closer proximity for device miniaturization while maintaining electrical isolation.
Data Source
AI summary
There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base.