Electronic Component Package Frame for Heat Dissipation and Warpage Control
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Solution Overview
Problem
Current electronic component packages face challenges in heat dissipation and warpage due to differences in thermal expansion coefficients and inadequate rigidity, which are exacerbated by the use of general molding resins and pre-pregs.
Innovation Solution
Incorporating a frame made from materials with excellent heat dissipation characteristics, such as Fe—Ni alloys or ceramic-based materials, to reduce warpage and improve thermal conductivity, while maintaining rigidity through the use of materials with low coefficients of thermal expansion and high elastic modulus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If general molding resins and pre-pregs are used for packaging electronic components, then ease of manufacture is improved, but heat dissipation performance deteriorates and warpage occurs due to inadequate rigidity and thermal conductivity
Solution Approach 1:
The patent employs a composite structure consisting of a metal frame (providing rigidity and thermal conductivity) combined with molding resin or pre-preg materials (providing ease of manufacture and component protection). This composite approach allows the package to achieve both manufacturability and improved heat dissipation performance through the metal frame's superior thermal properties while maintaining the formability and protective encapsulation capabilities of the polymer materials.
2Ease of manufacture
If general molding resins and pre-pregs are used for packaging electronic components, then ease of manufacture is improved, but warpage occurs due to difference in coefficients of thermal expansion
Solution Approach 1:
The metal frame in the composite structure provides dimensional stability and resists warpage due to its high rigidity and controlled thermal expansion characteristics. When combined with molding resin or pre-preg materials, the metal frame acts as a stabilizing element that compensates for the thermal expansion differences, maintaining package integrity during temperature cycling while preserving the ease of manufacture benefits of the polymer materials.
Solution Approach 2:
The patent utilizes materials with specific thermal and mechanical parameters - selecting metal frame materials with appropriate coefficients of thermal expansion and high elastic modulus to match or counterbalance the thermal expansion characteristics of the electronic components and polymer materials. This parameter optimization reduces thermal stress and prevents warpage while maintaining manufacturability.
3Reliability
If a frame made from materials with excellent heat dissipation characteristics is introduced, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent integrates a metal frame within the existing package structure, combining it with conventional molding resin or pre-preg materials. This composite design improves heat dissipation through the metal's superior thermal conductivity while leveraging the established manufacturing processes for polymer encapsulation, thereby limiting the increase in device complexity to only the addition of the frame component itself rather than overhauling the entire packaging system.
4Strength
If materials with high elastic modulus and low coefficients of thermal expansion are used for the frame, then rigidity is improved and warpage is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent selects metal frame materials with specific mechanical and thermal parameters - high elastic modulus for rigidity and controlled coefficient of thermal expansion to match electronic components. These parameter choices are optimized to achieve the desired mechanical performance while remaining compatible with standard manufacturing tolerances, balancing rigidity requirements with manufacturability constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances heat dissipation and reduces warpage in electronic component packages by utilizing materials with superior thermal conductivity and reduced thermal expansion differences, thereby improving the overall performance and reliability of the packages.
Implementation Method 1
a frame that may reinforce rigidity of an electronic component package using a material having excellent heat dissipation characteristics
Implementation Method 2
there is a need to significantly reduce the occurrence of warpage due to a difference between coefficients of thermal expansion (CTEs) of components configuring the electronic component package
Data Source
AI summary
An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.