Semiconductor Package Frame Composition for Cover Glass Thermal Mismatch
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Solution Overview
Problem
Conventional semiconductor packages face issues with crack, peel, and warp of the cover glass due to differences in thermal expansion coefficients between the package substrate, optical element, and cover glass, which can degrade image resolution and effective pixel region.
Innovation Solution
A semiconductor package design featuring a frame composed of multiple materials with varying thermal expansion coefficients, where the frame's composition gradually changes from the substrate to the cover glass, absorbing thermal expansion differences and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional package frame made of single material is used, then the manufacturing process is simple, but crack, peel, and warp of the cover glass occur due to thermal expansion coefficient differences
Solution Approach 1:
The package frame is constructed using a composite material comprising a resin matrix and inorganic filler particles, where the filler content varies across different regions of the frame. This composite structure enables the frame to have different thermal expansion coefficients in different areas, matching the thermal expansion characteristics of both the substrate and cover glass, thereby preventing crack, peel, and warp while maintaining structural integrity.
Solution Approach 2:
The frame exhibits local quality variation through controlled distribution of inorganic filler particles, where the filler concentration is higher in regions adjacent to the substrate and lower in regions adjacent to the cover glass. This spatially varying composition allows each region of the frame to have optimized thermal expansion properties matched to the adjacent component, resolving the thermal mismatch problem without requiring entirely separate frame components.
2Manufacturing precision
If the package frame is made with uniform material composition, then the manufacturing process is simple, but thermal expansion mismatch causes degradation of image resolution and pixel region
Solution Approach 1:
The thermal expansion coefficient of the frame is controlled by varying the inorganic filler content parameter across different regions. By adjusting the filler concentration from high near the substrate to low near the cover glass, the frame's thermal expansion behavior is tuned to match both adjacent components, preventing warping that would degrade image resolution while using a single continuous manufacturing process.
Solution Approach 2:
The frame exhibits local quality variation through controlled distribution of inorganic filler particles, where the filler concentration is higher in regions adjacent to the substrate and lower in regions adjacent to the cover glass. This spatially varying composition allows each region of the frame to have optimized thermal expansion properties matched to the adjacent component, resolving the thermal mismatch problem without requiring entirely separate frame components.
3Reliability
If a single-material frame is used, then the structure is simple, but thermal stress causes peel and warp of the cover glass
Solution Approach 1:
The package frame is constructed using a composite material comprising a resin matrix and inorganic filler particles, where the filler content varies across different regions of the frame. This composite structure enables the frame to have different thermal expansion coefficients in different areas, matching the thermal expansion characteristics of both the substrate and cover glass, thereby preventing crack, peel, and warp while maintaining structural integrity.
Solution Approach 2:
The frame acts as an intermediary component between the substrate and cover glass, with its composite material structure serving as a thermal expansion buffer. The varying inorganic filler distribution creates a gradient in thermal expansion coefficients that mediates the thermal stress between the two adjacent components, preventing direct stress transmission that would cause peel and warp.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses crack, peel, and warp of the cover glass, maintaining image resolution and pixel region integrity by matching thermal expansion coefficients, thus enhancing the reliability and performance of semiconductor packages.
Implementation Method 1
a possibility of occurrence of crack, peel, warp and the like of the cover glass due to a difference in thermal expansion coefficient (CTE) between the package substrate, the optical element, the package frame, and the cover glass
Data Source
AI summary
The present technology relates to a semiconductor package and an electronic device capable of providing a semiconductor package capable of enhancing reliability and suppressing characteristic deterioration by adopting a configuration that absorbs a difference in thermal expansion coefficient between a substrate and a cover glass.A semiconductor package includes a substrate, a chip disposed on the substrate, a frame disposed on the substrate so as to surround the chip, and a cover glass disposed on the frame, in which the frame includes a composition of two or more kinds of materials. Alternatively, the frame has a cavity, and the cavity has different sizes between a side of the substrate and a side of the cover glass. The present technology is applicable to, for example, a semiconductor package including an imaging element as a chip.