Semiconductor Package Frame Structure for Warpage and Heat Dissipation
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic systems poses challenges due to issues such as warpage and delamination in existing packaging techniques, which affect thermal performance and electrical connectivity.
Innovation Solution
A semiconductor device design incorporating a package frame with inner and outer flanges and a roof structure that encircles the semiconductor package, providing controlled thermal interface and reduced warpage, while maintaining exposure for efficient heat dissipation and securing the package frame to the circuit substrate with adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional packaging techniques are used to integrate multiple semiconductor devices, then device integration is achieved, but warpage and delamination occur affecting thermal performance and electrical connectivity
Solution Approach 1:
The package frame is divided into multiple functional segments: a body portion providing structural support, flanges extending from the body for additional anchoring, and a roof portion covering the semiconductor devices. This segmentation allows each part to address specific issues - the body provides rigidity while flanges prevent delamination at critical interfaces.
Solution Approach 2:
The package frame utilizes composite construction combining materials with different thermal and mechanical properties. The frame structure integrates thermally conductive materials for heat dissipation paths while incorporating adhesive layers with controlled properties to manage stress distribution and prevent delamination between dissimilar materials.
2Stability of the object's composition
If package frame fully covers semiconductor package for structural support, then warpage is reduced, but heat dissipation efficiency decreases
Solution Approach 1:
The roof portion of the package frame is designed with non-uniform coverage - it extends over the periphery of the semiconductor package to provide maximum structural support and warpage control at the edges, while deliberately leaving the central region exposed. This local differentiation allows heat to dissipate efficiently from the device center while maintaining structural integrity through peripheral coverage.
3Strength
If adhesive is applied extensively to secure package frame, then structural integrity is improved, but voids and stress concentration increase
Solution Approach 1:
The flanges are designed to extend beyond the body portion and make contact with the circuit substrate before the roof portion is attached. This preliminary action creates initial anchoring points that distribute adhesive application and curing stresses, preventing void formation and stress concentration in subsequent bonding steps.
Solution Approach 2:
The package frame transitions from a two-dimensional planar adhesive interface to a three-dimensional structure with flanges extending in multiple directions. This dimensional change distributes the bonding interface across multiple planes and surfaces, reducing stress concentration at any single location and minimizing void formation through improved adhesive flow and curing uniformity.
Data Source
AI summary
A semiconductor device includes a circuit substrate, a semiconductor package, and a package frame. The semiconductor package is disposed on the circuit substrate. The package frame is disposed over the circuit substrate. The package frame encircles the semiconductor package. The semiconductor package has a first surface facing the circuit substrate and a second surface opposite to the first surface. The package frame leaves exposed at least a portion of the second surface of the semiconductor package. The package frame forms a cavity, which cavity encircles the semiconductor package.