Semiconductor Package Interconnect Gap Fill for Interface Crack Control
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Solution Overview
Problem
Semiconductor packages face issues with voids and cracks at interfaces between heterogeneous materials, leading to reduced reliability and yield.
Innovation Solution
A semiconductor package design incorporating an interconnection structure with a gap fill layer that fills the gap between pattern layers and an insulating material layer, enhancing reliability by preventing voids and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heterogeneous materials (semiconductor chip, redistribution structure, encapsulant) are assembled to form a semiconductor package, then functional integration and electrical connectivity are achieved, but voids and cracks occur at interfaces between materials, reducing reliability
Solution Approach 1:
The patent introduces an intermediate layer or modified interface structure between heterogeneous materials (semiconductor chip, redistribution structure, encapsulant) to act as a mediator that reduces thermal expansion mismatch and mechanical stress concentration. This intermediate structure prevents direct contact between incompatible materials, thereby eliminating voids and cracks at interfaces while maintaining electrical connectivity and functional integration.
Solution Approach 2:
The patent modifies physical or chemical parameters of the interface materials, such as adjusting thermal expansion coefficients, modifying surface energy, or changing material composition at the interface. By changing these parameters, the patent reduces the mismatch between heterogeneous materials, preventing stress-induced defects like voids and cracks while preserving the functional integration of the package.
2Ease of manufacture
If conventional packaging materials and structures are used, then manufacturing simplicity is maintained, but voids and cracks form at material interfaces, reducing yield and reliability
Solution Approach 1:
The patent applies preliminary treatments to the interface materials before final assembly, such as pre-coating adhesive layers, pre-heating materials to reduce thermal shock, or pre-forming intermediate structures. These preliminary actions prevent voids and cracks from forming during subsequent assembly and curing processes, improving interface quality without significantly complicating the overall manufacturing workflow.
3Device complexity
If standard interconnection structures are used without gap fill layers, then device complexity is minimized, but voids and cracks occur between pattern layers and insulating material, reducing reliability
Solution Approach 1:
The patent applies gap fill layers selectively at specific locations where voids and cracks are most likely to form, such as at the interfaces between pattern layers and insulating material. Rather than modifying the entire interconnection structure, the patent targets only the critical interface regions with localized gap fill materials, thereby improving interconnection reliability with minimal increase in overall device complexity.
Data Source
AI summary
A semiconductor package includes a first redistribution structure including a gap fill layer covering at least a portion of interconnection patterns, a first insulating layer covering the gap fill layer, a first redistribution layer below the first insulating layer, and a first redistribution via electrically connecting the first redistribution layer to the interconnection patterns, wherein the interconnection patterns include a first pattern layer adjacent to a first surface and embedded in the insulating material layer, and a second pattern layer adjacent to a second surface and protruding on the insulating material layer, and the gap fill layer fills at least a portion of a first region between a side surface of the first pattern layer and the insulating material layer, and at least a portion of a second region between a lower surface of the first pattern layer and the first insulating layer.