Semiconductor Package Heat-Dissipation Grooves for Compact Chip Cooling
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Solution Overview
Problem
The miniaturization of electronic devices limits the size of semiconductor package devices, making it challenging to effectively dissipate heat generated by high-performance chips, which requires an improved heat dissipation solution.
Innovation Solution
The semiconductor package device incorporates heat-dissipation grooves on the chip surface, which are not covered by the encapsulation layer, increasing the heat dissipation area and allowing for efficient heat transfer through these grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chip size is increased to provide better heat dissipation, then heat dissipation performance is improved, but the device size limitation is violated
Solution Approach 1:
The patent transitions from two-dimensional surface heat dissipation to three-dimensional heat dissipation by forming grooves that extend vertically into the chip substrate. The grooves create additional heat dissipation surfaces at different depth levels, effectively utilizing the third dimension (depth) to increase the total heat dissipation area without expanding the chip's planar footprint.
Solution Approach 2:
The chip surface is segmented into multiple regions by forming grooves that divide the substrate into distinct sections. This segmentation creates multiple exposed surfaces and internal walls that collectively increase the heat dissipation area. The grooves partition the chip structure to maximize surface exposure for heat transfer while maintaining the overall compact form factor.
2Temperature
If heat dissipation structures are added to the chip, then heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation function is segmented from the encapsulation layer and integrated directly into the chip substrate through grooves. This eliminates the need for separate heat dissipation components and simplifies the overall structure by combining multiple functions (structural support and heat dissipation) into a single integrated element.
Solution Approach 2:
The patent merges the heat dissipation function with the chip substrate structure itself. The grooves are formed directly in the chip, combining the structural body with the heat dissipation feature, thereby reducing the number of separate components and simplifying the overall device architecture while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the heat dissipation efficiency of the semiconductor package device by providing a larger surface area for heat dissipation, effectively managing the heat generated by high-performance chips within the constrained size of the device.
Implementation Method 1
heat-dissipation grooves on the chip surface... allowing for efficient heat transfer through these grooves
Implementation Method 2
providing a larger surface area for heat dissipation
Data Source
AI summary
A semiconductor package device and a method of manufacturing thereof are provided. The semiconductor package device includes a circuit layer including a conductive circuit, and conductive pads connected to the conductive circuit; a chip disposed on the circuit layer, and connected to the conductive circuit, wherein the chip has a side surface, an upper surface, and heat-dissipation grooves formed on the upper surface; and an encapsulation layer covering on the circuit layer, and covering the side surface of the chip. The heat-dissipation grooves are exposed from the encapsulation layer.