Semiconductor Package Grooving for Die Delamination Containment
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Solution Overview
Problem
Delamination in semiconductor dies due to stress from swelling and expansion of molding compound during reliability testing, leading to package failures and reduced yield.
Innovation Solution
Incorporating a second groove between the first groove and the seal ring of the semiconductor die to contain potential delamination, formed through laser grooving before attachment to the substrate, which prevents stress propagation into the active region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If molding compound is used to encapsulate semiconductor die, then protection and structural integrity are improved, but stress-induced delamination occurs during reliability testing
Solution Approach 1:
The patent divides the encapsulation structure into multiple segments by forming grooves that create separate regions: a first groove containing molding compound and a second groove containing a different material. This segmentation allows each region to handle stress differently, preventing delamination while maintaining overall structural integrity.
Solution Approach 2:
The patent applies different materials with different properties to different locations within the encapsulation structure. The first groove is filled with molding compound for general protection, while the second groove is filled with a material having different stress properties to specifically address delamination risks at critical interfaces.
2Productivity
If semiconductor dies are stacked to reduce footprint, then packaging density is improved, but stress concentration increases leading to higher delamination risk
Solution Approach 1:
In stacked semiconductor die configurations, the patent introduces grooves that segment the encapsulation material into distinct regions. This segmentation distributes and reduces stress concentration at critical interfaces between stacked dies, allowing higher packaging density without proportionally increasing delamination risk.
3Manufacturing precision
If groove is formed for blade sawing separation, then manufacturing precision is improved, but additional stress relief structure is needed to prevent delamination
Solution Approach 1:
The patent makes the groove structure multi-functional: the first groove serves both as a singulation guide for precise blade sawing separation and as a stress-management feature by containing molding compound. The additional second groove specifically addresses delamination prevention, allowing the groove system to simultaneously achieve manufacturing precision and reliability enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the likelihood of delamination and increases semiconductor device package yield by mitigating stress-induced failures.
Implementation Method 1
Laser grooving can be performed to form grooves in the semiconductor die prior to blade sawing
Data Source
AI summary
A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.