Semiconductor Package Header Grounding to Limit Heat Feedback

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Semiconductor packages with integrated Peltier devices face challenges in stabilizing oscillation wavelength and maintaining electrical continuity, leading to undesirable floating states and heat feedback issues due to the need for additional metal wires for improved electric characteristics.

Innovation Solution

A header for semiconductor packages is designed with strategically positioned metal blocks and substrates, allowing for efficient electrical connections and heat management through exposed ground patterns and minimal wiring, preventing heat feedback while maintaining electrical integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal wires are added to connect metal blocks for improving electric characteristics, then electrical continuity is improved, but heat feedback to the light emitting device increases

Engineering Contradiction:

Improveelectrical continuityVSAvoidheat feedback

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention divides the grounding path into two separate segments: one through the metal block and another through the substrate back surface. This segmentation allows the signal ground to be established without requiring additional metal wires that would conduct heat back to the light emitting device, thus resolving the contradiction between electrical continuity and heat feedback prevention.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate back surface ground pattern acts as an intermediary element that provides electrical continuity between the metal block and the reference potential without creating a direct thermal conduction path. This intermediary approach allows signal grounding while preventing heat feedback through the metal wires.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If the device mounting substrate is arranged on the Peltier device, then temperature control is achieved, but electrical floating state occurs

Engineering Contradiction:

Improvetemperature controlVSAvoidelectrical continuity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The invention merges the thermal management function (Peltier device) with the electrical grounding function by providing a ground pattern on the substrate back surface that contacts the metal block. This merging allows the substrate to simultaneously serve as both a mounting platform for temperature control and an electrical ground reference, eliminating the floating state without compromising thermal performance.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If relay substrate and metal block are arranged on eyelet with Peltier device, then oscillation wavelength stabilization is achieved, but transmission loss increases due to long transmission line

Engineering Contradiction:

Improveoscillation wavelength stabilizationVSAvoidtransmission loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The invention addresses the long transmission line issue by providing a direct ground reference through the substrate back surface contact with the metal block. This creates a shorter electrical reference path in the vertical dimension, reducing the effective transmission line length and associated losses while maintaining the wavelength stabilization function.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances electric characteristics by ensuring electrical continuity without excessive heat feedback, improving signal processing capabilities while maintaining a compact design.

Implementation Method 1

a Peltier device, which is a temperature regulator, may be provided inside the semiconductor package

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

connecting the metal block which holds the back surface of the relay substrate and the metal block which holds the back surface of the device mounting substrate by a metal wire

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

the heat of the light emitting device transferred by the Peltier device will not be fed back to the light emitting device by passing through the relay substrate or the like again

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11923652B2Header for semiconductor package, and semiconductor package

Publication Date: 2024.03.05 SHINKO ELECTRIC IND CO LTD

AI summary

A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.