Electronic Package Structure for Heat Dissipation and Low Inductance
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Solution Overview
Problem
Existing electronic component packages face challenges in efficiently radiating heat generated by components due to limited thermal conductivity and increased parasitic inductance from longer wiring lengths, which affects the performance of electronic components.
Innovation Solution
A package design with a larger second portion than the first portion, utilizing materials with high thermal conductivity, such as copper or aluminum, to efficiently radiate heat and reduce parasitic inductance by arranging the electronic component in a mesa shape with a thermally conductive mounting region and a heat sink, and optionally using columns to prevent distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a package larger in size than the electronic component is used to increase heat radiation performance, then heat dissipation efficiency is improved, but parasitic inductance increases due to longer wiring lengths
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by stacking multiple electronic components vertically on the package substrate. This vertical arrangement allows heat to be dissipated from multiple surfaces (top, bottom, and sides) simultaneously, significantly improving heat dissipation efficiency without requiring a larger package footprint, thereby avoiding increased parasitic inductance from longer wiring lengths.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for mounting electronic components, establishes electrical connections through wiring layers, and acts as a heat dissipation path through its ground layers and thermal conduction to the package casing. This multi-functionality allows the same structure to address both electrical connectivity and thermal management without compromising either performance.
2Temperature
If materials with high thermal conductivity are used for the package, then heat radiation performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent modifies the thermal conductivity parameter of the package substrate by selecting materials with higher thermal conductivity values. The substrate is designed with ground layers and thermal conduction paths that leverage this material property to efficiently conduct heat away from mounted components, improving heat radiation performance while maintaining compatibility with standard PCB manufacturing processes.
3Temperature
If the package size is increased to improve heat dissipation, then thermal resistance is reduced, but wiring length increases causing higher parasitic inductance
Solution Approach 1:
The patent utilizes the vertical dimension by stacking electronic components above and below the package substrate. This three-dimensional configuration enables heat dissipation from multiple surfaces simultaneously, reducing thermal resistance without requiring an increase in the planar footprint of the package, thereby keeping wiring lengths short and parasitic inductance low.
Solution Approach 2:
The package structure is segmented into multiple functional layers including top ground layers, bottom ground layers, and intermediate wiring layers. Each layer serves as an independent heat dissipation path and electrical connection route, allowing heat to be conducted away through multiple parallel paths while maintaining short current paths for signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package effectively radiates heat generated by electronic components, reducing thermal resistance and parasitic inductance, thereby enhancing the performance and reliability of the components by ensuring efficient heat dissipation and minimizing wiring length.
Implementation Method 1
By using a material with high thermal conductivity for a package, heat generated by an electronic component can be efficiently emitted to outside of the package
Implementation Method 2
To increase the performance of radiating heat generated by an electronic component, a package that is larger in size than the electronic component is used
Data Source
AI summary
A package includes: a first portion having defined therein a mounting region in which an electronic component is mounted; and a second portion connected to the first portion. An area of the second portion is larger than an area of the first portion in plain view viewed from the direction normal to a surface through which the first portion and the second portion are connected.