Semiconductor Package Heat Path Around Passive Components
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently dissipating heat generated by semiconductor dies and passive components, leading to increased design complexity, time, and cost, as well as reduced flexibility in component design.
Innovation Solution
The electronic device incorporates separate heat dissipating members external to the passive components, utilizing a multi-layer substrate with thermally conductive components that circumscribe passive components, providing efficient heat dissipation pathways without requiring heat dissipation integration into passive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is integrated into passive components, then heat dissipation effectiveness is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The heat dissipation function is segmented from the passive components and assigned to separate thermally conductive components. The passive components maintain their original simple designs while dedicated heat dissipation structures (thermally conductive components with heat dissipation fins) handle the thermal management, resolving the contradiction between heat dissipation effectiveness and design complexity
Solution Approach 2:
The heat dissipation function is extracted from the passive components and implemented as separate thermally conductive components. This allows passive components to remain simple while thermal management is handled by specialized structures, reducing overall device complexity while maintaining effective heat dissipation
2Temperature
If heat dissipation is integrated into passive components, then heat dissipation effectiveness is improved, but manufacturing time and cost increase
Solution Approach 1:
By segmenting the heat dissipation function into separate thermally conductive components, the manufacturing process is simplified. Passive components can be manufactured using standard processes while thermally conductive components are added separately, reducing overall manufacturing time and cost while maintaining effective heat dissipation
3Temperature
If heat dissipation is integrated into passive components, then heat dissipation effectiveness is improved, but design flexibility is reduced
Solution Approach 1:
The segmentation of heat dissipation function into separate thermally conductive components allows passive components to be designed independently without thermal constraints. Engineers can swap or modify passive components freely while the thermally conductive components remain unchanged, maintaining design flexibility while achieving effective heat dissipation
Solution Approach 2:
The thermally conductive components serve as universal heat dissipation structures that can work with multiple different passive components. This multi-functionality allows the same thermally conductive component to support various passive component designs, enhancing design flexibility while maintaining effective thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity and cost while enhancing design flexibility by allowing engineers to swap passive components without additional heat dissipation modifications, achieving effective heat expulsion through multiple pathways.
Implementation Method 1
a first thermally conductive component contacting the second surface of the semiconductor die and contacting the second contact
Implementation Method 2
These semiconductor packages may also include other components, such as semiconductor dies. The semiconductor dies, as well as other components of the semiconductor package, can generate substantial amounts of heat. The semiconductor package can be damaged if the heat is not expelled.
Data Source
AI summary
In examples, an electronic device comprises a multi-layer substrate including multiple metal layers and a solid dielectric layer positioned between the multiple metal layers, the multi-layer substrate including first and second contacts coupled to the multiple metal layers. The electronic device comprises a semiconductor die having a first surface coupled to the multi-layer substrate and a second surface opposite the first surface, and a passive component having a conductive terminal coupled to the first contact. The electronic device includes a first thermally conductive component contacting the second surface of the semiconductor die and contacting the second contact, the first thermally conductive component positioned between the semiconductor die and the passive component. The electronic device includes a second thermally conductive component coupled to the first thermally conductive component, the second thermally conductive component circumscribing the passive component.