Electronic Package Heat Sink Layout for Encapsulation Cooling
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Solution Overview
Problem
Conventional semiconductor packages suffer from poor heat dissipation due to the use of molding compounds with low thermal conductivity, leading to potential damage to semiconductor components and affecting product reliability.
Innovation Solution
An electronic package is designed with a carrier structure, an electronic component electrically connected to the circuit layer, a heat sink positioned over the electronic component, an encapsulation layer covering the heat sink, and a heat dissipation structure embedded in the encapsulation layer, allowing for effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is used to cover semiconductor components, then component protection is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent uses a composite encapsulation structure combining molding compound and heat dissipation material. The molding compound provides protection while the heat dissipation material (with higher thermal conductivity) is integrated into the encapsulation layer to conduct heat away from the semiconductor component, resolving the contradiction between protection and heat dissipation.
Solution Approach 2:
The heat dissipation material is selectively placed in the encapsulation layer at positions where heat dissipation is most needed, specifically forming a heat dissipation structure that contacts the semiconductor component. This local application of heat dissipation functionality maintains component protection while addressing thermal issues at critical locations.
2Temperature
If heat dissipation structure is added to improve thermal management, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat dissipation function is merged with the encapsulation layer by incorporating heat dissipation material directly into the encapsulation structure. This integration allows the encapsulation to simultaneously provide both protection and heat dissipation functions, reducing overall device complexity while maintaining effective thermal management.
Solution Approach 2:
The encapsulation layer is designed to serve multiple functions: it provides mechanical protection to the semiconductor component, electrical insulation, and thermal management through the integrated heat dissipation material. This multi-functionality reduces the need for separate heat dissipation components, thereby simplifying the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively dissipates heat during operation, improving product reliability while maintaining a low cost and flexibility in packaging specifications, and can be manufactured using existing materials and processes.
Implementation Method 1
a heat sink disposed on the electronic component
Implementation Method 2
the heat sink is bonded to the electronic component via an adhesive material
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic component and a heat dissipation structure having an opening are arranged on a carrier structure, a heat sink is arranged in the opening and bonded to the electronic component, and the electronic component, the heat dissipation structure and the heat sink are covered with an encapsulation layer, such that the heat sink can be arranged according to a heat source of a specific part of the electronic component so as to effectively dissipate heat.